Development of high on/off current ratio in p-type copper oxide thin-film transistors with a back-end-of-line compatible process

The objective of this study is to develop an efficient process to synthesize wafer scale p-type cuprous oxide (Cu2O) with the back-end-of-line (BEOL) compatible process (

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Veröffentlicht in:Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2024-09, Vol.42 (5)
Hauptverfasser: Kuo, Chi-Yuan, Lin, Wei-Chen, Lo, Tsung-Tien, Shen, Ching-Hsuan, Shen, Ming-Yu, Lee, Chia-Chan, Lin, Chi-Ping, Lin, Yuang-Ming, Huang, Haw-Tyng, Yeh, Po-Chun, Chen, Hsin-Chu, Wu, Chih-I
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container_issue 5
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container_title Journal of vacuum science & technology. A, Vacuum, surfaces, and films
container_volume 42
creator Kuo, Chi-Yuan
Lin, Wei-Chen
Lo, Tsung-Tien
Shen, Ching-Hsuan
Shen, Ming-Yu
Lee, Chia-Chan
Lin, Chi-Ping
Lin, Yuang-Ming
Huang, Haw-Tyng
Yeh, Po-Chun
Chen, Hsin-Chu
Wu, Chih-I
description The objective of this study is to develop an efficient process to synthesize wafer scale p-type cuprous oxide (Cu2O) with the back-end-of-line (BEOL) compatible process (
doi_str_mv 10.1116/5.0226672
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Metallic copper is deposited on SiO2/Si substrates followed by rapid thermal oxidation to oxidize it into large-area, uniform Cu2O. Bottom-gate Cu2O thin-film transistors (TFTs) were fabricated as gate dielectric on 100 nm thermal oxide. The results of the ID-VG curve demonstrate that we have successfully fabricated BEOL-compatible p-type Cu2O TFTs. The drain-off current can be achieved to 0.1 pA, with the highest on/off ratio reaching up to 6 orders. Significantly, the TFT with an on/off ratio of 106 is sufficient to meet the requirements for digital circuit applications, including logic circuits, and the BEOL-compatible process (&lt;400 °C) can fulfill the demands of monolithic 3D integrated circuits, expanding the scope of functional integration applications. Additionally, positive bias stress reliability testing indicated a high-quality passivation layer. 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Significantly, the TFT with an on/off ratio of 106 is sufficient to meet the requirements for digital circuit applications, including logic circuits, and the BEOL-compatible process (&lt;400 °C) can fulfill the demands of monolithic 3D integrated circuits, expanding the scope of functional integration applications. Additionally, positive bias stress reliability testing indicated a high-quality passivation layer. These findings suggest that material improvements have significantly enhanced the performance of Cu2O TFTs.</abstract><doi>10.1116/5.0226672</doi><tpages>6</tpages><orcidid>https://orcid.org/0009-0003-4698-4842</orcidid></addata></record>
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title Development of high on/off current ratio in p-type copper oxide thin-film transistors with a back-end-of-line compatible process
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