Molecular dynamics simulations of ion self-sputtering of Ni and Al surfaces
We present results of molecular dynamics simulations of Ni + impacting Ni(111) and Al + impacting Al (111) and amorphous Al surfaces. Sputter yields and sticking probabilities were calculated as a function of ion fluence, impact angle (0–90°) and energy (25–150 eV). We find that the simulated sputte...
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| Veröffentlicht in: | Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2001-05, Vol.19 (3), p.820-825 |
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| container_title | Journal of vacuum science & technology. A, Vacuum, surfaces, and films |
| container_volume | 19 |
| creator | Hanson, D. E. Stephens, B. C. Saravanan, C. Kress, J. D. |
| description | We present results of molecular dynamics simulations of
Ni
+
impacting Ni(111) and
Al
+
impacting Al (111) and amorphous Al surfaces. Sputter yields and sticking probabilities were calculated as a function of ion fluence, impact angle (0–90°) and energy (25–150 eV). We find that the simulated sputter yields are in reasonable agreement with experiments and a commonly used empirical formula. For
Al
+
impacting at normal incidence, sputter yields were approximately the same for both Al(111) and amorphous Al. The initial penetration depth exhibited a linear dependence with velocity, and was approximately the same for both
Al
+
/Al(111)
and
Ni
+
/Ni(111)
if the distances were scaled by the lattice constants. The average calculated time between ion impact and atom ejection was less than 25 fs for 100 eV
Ni
+
/Si(111)
sputter events. |
| doi_str_mv | 10.1116/1.1365134 |
| format | Article |
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Ni
+
impacting Ni(111) and
Al
+
impacting Al (111) and amorphous Al surfaces. Sputter yields and sticking probabilities were calculated as a function of ion fluence, impact angle (0–90°) and energy (25–150 eV). We find that the simulated sputter yields are in reasonable agreement with experiments and a commonly used empirical formula. For
Al
+
impacting at normal incidence, sputter yields were approximately the same for both Al(111) and amorphous Al. The initial penetration depth exhibited a linear dependence with velocity, and was approximately the same for both
Al
+
/Al(111)
and
Ni
+
/Ni(111)
if the distances were scaled by the lattice constants. The average calculated time between ion impact and atom ejection was less than 25 fs for 100 eV
Ni
+
/Si(111)
sputter events.</description><identifier>ISSN: 0734-2101</identifier><identifier>EISSN: 1520-8559</identifier><identifier>DOI: 10.1116/1.1365134</identifier><identifier>CODEN: JVTAD6</identifier><language>eng</language><subject>Aluminum ; Atoms ; Boundary conditions ; Ions ; Lattice constants ; Nickel deposits ; Physical vapor deposition ; Sputtering ; Substrates</subject><ispartof>Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2001-05, Vol.19 (3), p.820-825</ispartof><rights>American Vacuum Society</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c430t-faa38e17fbe04506be0558124e4ed969d6a3c2770a258de996d518efa855830c3</citedby><cites>FETCH-LOGICAL-c430t-faa38e17fbe04506be0558124e4ed969d6a3c2770a258de996d518efa855830c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,794,4512,27924,27925</link.rule.ids></links><search><creatorcontrib>Hanson, D. E.</creatorcontrib><creatorcontrib>Stephens, B. C.</creatorcontrib><creatorcontrib>Saravanan, C.</creatorcontrib><creatorcontrib>Kress, J. D.</creatorcontrib><title>Molecular dynamics simulations of ion self-sputtering of Ni and Al surfaces</title><title>Journal of vacuum science & technology. A, Vacuum, surfaces, and films</title><description>We present results of molecular dynamics simulations of
Ni
+
impacting Ni(111) and
Al
+
impacting Al (111) and amorphous Al surfaces. Sputter yields and sticking probabilities were calculated as a function of ion fluence, impact angle (0–90°) and energy (25–150 eV). We find that the simulated sputter yields are in reasonable agreement with experiments and a commonly used empirical formula. For
Al
+
impacting at normal incidence, sputter yields were approximately the same for both Al(111) and amorphous Al. The initial penetration depth exhibited a linear dependence with velocity, and was approximately the same for both
Al
+
/Al(111)
and
Ni
+
/Ni(111)
if the distances were scaled by the lattice constants. The average calculated time between ion impact and atom ejection was less than 25 fs for 100 eV
Ni
+
/Si(111)
sputter events.</description><subject>Aluminum</subject><subject>Atoms</subject><subject>Boundary conditions</subject><subject>Ions</subject><subject>Lattice constants</subject><subject>Nickel deposits</subject><subject>Physical vapor deposition</subject><subject>Sputtering</subject><subject>Substrates</subject><issn>0734-2101</issn><issn>1520-8559</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNp9kM1KxDAYRYMoWEcXvkF2otAxX9Kk7XIY_MNRN7oOMU0k0j_ztcK8vR1n0IXg6sDlcOFeQk6BzQFAXcIchJIgsj2SgOQsLaQs90nCcpGlHBgckiPEd8YY50wl5P6hq50daxNptW5NEyxSDM0UDKFrkXaeTqToap9iPw6Di6F928SPgZq2ooua4hi9sQ6PyYE3NbqTHWfk5frqeXmbrp5u7paLVWozwYbUGyMKB7l_dSyTTE2QsgCeucxVpSorZYTlec4Ml0XlylJVEgrnzTSlEMyKGTnb9vax-xgdDroJaF1dm9Z1I-o8UwKE5GIyz7emjR1idF73MTQmrjUwvflLg979NbkXWxdtGL7X_8ifXfwVdV_5_-S_zV-yLHhx</recordid><startdate>20010501</startdate><enddate>20010501</enddate><creator>Hanson, D. E.</creator><creator>Stephens, B. C.</creator><creator>Saravanan, C.</creator><creator>Kress, J. D.</creator><scope>AAYXX</scope><scope>CITATION</scope><scope>7TC</scope></search><sort><creationdate>20010501</creationdate><title>Molecular dynamics simulations of ion self-sputtering of Ni and Al surfaces</title><author>Hanson, D. E. ; Stephens, B. C. ; Saravanan, C. ; Kress, J. D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c430t-faa38e17fbe04506be0558124e4ed969d6a3c2770a258de996d518efa855830c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Aluminum</topic><topic>Atoms</topic><topic>Boundary conditions</topic><topic>Ions</topic><topic>Lattice constants</topic><topic>Nickel deposits</topic><topic>Physical vapor deposition</topic><topic>Sputtering</topic><topic>Substrates</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hanson, D. E.</creatorcontrib><creatorcontrib>Stephens, B. C.</creatorcontrib><creatorcontrib>Saravanan, C.</creatorcontrib><creatorcontrib>Kress, J. D.</creatorcontrib><collection>CrossRef</collection><collection>Mechanical Engineering Abstracts</collection><jtitle>Journal of vacuum science & technology. A, Vacuum, surfaces, and films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hanson, D. E.</au><au>Stephens, B. C.</au><au>Saravanan, C.</au><au>Kress, J. D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Molecular dynamics simulations of ion self-sputtering of Ni and Al surfaces</atitle><jtitle>Journal of vacuum science & technology. A, Vacuum, surfaces, and films</jtitle><date>2001-05-01</date><risdate>2001</risdate><volume>19</volume><issue>3</issue><spage>820</spage><epage>825</epage><pages>820-825</pages><issn>0734-2101</issn><eissn>1520-8559</eissn><coden>JVTAD6</coden><abstract>We present results of molecular dynamics simulations of
Ni
+
impacting Ni(111) and
Al
+
impacting Al (111) and amorphous Al surfaces. Sputter yields and sticking probabilities were calculated as a function of ion fluence, impact angle (0–90°) and energy (25–150 eV). We find that the simulated sputter yields are in reasonable agreement with experiments and a commonly used empirical formula. For
Al
+
impacting at normal incidence, sputter yields were approximately the same for both Al(111) and amorphous Al. The initial penetration depth exhibited a linear dependence with velocity, and was approximately the same for both
Al
+
/Al(111)
and
Ni
+
/Ni(111)
if the distances were scaled by the lattice constants. The average calculated time between ion impact and atom ejection was less than 25 fs for 100 eV
Ni
+
/Si(111)
sputter events.</abstract><doi>10.1116/1.1365134</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0734-2101 |
| ispartof | Journal of vacuum science & technology. A, Vacuum, surfaces, and films, 2001-05, Vol.19 (3), p.820-825 |
| issn | 0734-2101 1520-8559 |
| language | eng |
| recordid | cdi_scitation_primary_10_1116_1_1365134 |
| source | AIP Journals Complete |
| subjects | Aluminum Atoms Boundary conditions Ions Lattice constants Nickel deposits Physical vapor deposition Sputtering Substrates |
| title | Molecular dynamics simulations of ion self-sputtering of Ni and Al surfaces |
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