Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate

Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low thermal expansion coefficient, and excellent insulation properties. However, pores in the green tape from the tape casting process reduce the thermal conductivity and permittivity...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of applied physics 2024-10, Vol.136 (16)
Hauptverfasser: Lyu, Yang, Sun, Guoli, Ouyang, Xueqiong, Liu, Wencai, Liu, Qing, Shen, Yi, Wang, Shuangxi
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue 16
container_start_page
container_title Journal of applied physics
container_volume 136
creator Lyu, Yang
Sun, Guoli
Ouyang, Xueqiong
Liu, Wencai
Liu, Qing
Shen, Yi
Wang, Shuangxi
description Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low thermal expansion coefficient, and excellent insulation properties. However, pores in the green tape from the tape casting process reduce the thermal conductivity and permittivity of the sintered ceramic substrate. Researchers have attempted to minimize ceramic porosity with chemical additives or by sintering pure alumina at temperatures above 1650 °C, but these methods often degrade thermal conductivity or quality of substrate evenness. This study proposes a low-cost casting-warm pressing process to densify pure alumina ceramic substrates using micro–nano-mixed alumina powders and sintering at relatively low temperatures. The results indicate that the relative density of the pure alumina ceramic substrate prepared at 1500 °C is 93%, a 4.4% improvement over the tape casting process. Additionally, the thermal conductivity of the alumina substrate from the casting-warm pressing process reaches 15.89 W/(m K), which is 1.4 times higher than that of the tape casting process. Microstructure analysis shows that the casting-warm pressing process with micro- and nano-multi-scale mixed alumina powders forms a novel thermal conduction enhancement mechanism. Large particles in the green tape overlap, while small particles fill the spaces between the large particles. The connected micrometer-sized particle skeletons form high thermal conduction net channels in the substrate, improving the thermal conductivity for heat transfer.
doi_str_mv 10.1063/5.0216084
format Article
fullrecord <record><control><sourceid>proquest_scita</sourceid><recordid>TN_cdi_scitation_primary_10_1063_5_0216084</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3123896672</sourcerecordid><originalsourceid>FETCH-LOGICAL-c182t-43523210ded6c77ee55d8c48aaceeb4303864ac345602b3bd24309da4651cd8c3</originalsourceid><addsrcrecordid>eNp9kMtKAzEUhoMoWKsL32DAlcLU3CezLMVLodCNrkMmk9GUmaQmGaU738E39ElMadcuDuc_h-9c-AG4RnCGICf3bAYx4lDQEzBBUNRlxRg8BROY26Woq_ocXMS4gRAhQeoJ6Jau60fjtCl8V2gVk3Vv5ZcKQ7ENJsZcZeF1loV3RXo3-wiD6gvtXTvqZD9t2u2HB6uD__3-ccr5ct7jNSni2MQUVDKX4KxTfTRXxzwFr48PL4vncrV-Wi7mq1IjgVNJCcMEI9ialuuqMoaxVmgqlNLGNJRAIjhVmlDGIW5I0-Lcq1tFOUM6k2QKbg57888fo4lJbvwYXD4pCcJE1JxXOFO3Byo_HGMwndwGO6iwkwjKvY2SyaONmb07sFHbpJL17h_4D7Unc0w</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>3123896672</pqid></control><display><type>article</type><title>Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate</title><source>Alma/SFX Local Collection</source><creator>Lyu, Yang ; Sun, Guoli ; Ouyang, Xueqiong ; Liu, Wencai ; Liu, Qing ; Shen, Yi ; Wang, Shuangxi</creator><creatorcontrib>Lyu, Yang ; Sun, Guoli ; Ouyang, Xueqiong ; Liu, Wencai ; Liu, Qing ; Shen, Yi ; Wang, Shuangxi</creatorcontrib><description>Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low thermal expansion coefficient, and excellent insulation properties. However, pores in the green tape from the tape casting process reduce the thermal conductivity and permittivity of the sintered ceramic substrate. Researchers have attempted to minimize ceramic porosity with chemical additives or by sintering pure alumina at temperatures above 1650 °C, but these methods often degrade thermal conductivity or quality of substrate evenness. This study proposes a low-cost casting-warm pressing process to densify pure alumina ceramic substrates using micro–nano-mixed alumina powders and sintering at relatively low temperatures. The results indicate that the relative density of the pure alumina ceramic substrate prepared at 1500 °C is 93%, a 4.4% improvement over the tape casting process. Additionally, the thermal conductivity of the alumina substrate from the casting-warm pressing process reaches 15.89 W/(m K), which is 1.4 times higher than that of the tape casting process. Microstructure analysis shows that the casting-warm pressing process with micro- and nano-multi-scale mixed alumina powders forms a novel thermal conduction enhancement mechanism. Large particles in the green tape overlap, while small particles fill the spaces between the large particles. The connected micrometer-sized particle skeletons form high thermal conduction net channels in the substrate, improving the thermal conductivity for heat transfer.</description><identifier>ISSN: 0021-8979</identifier><identifier>EISSN: 1089-7550</identifier><identifier>DOI: 10.1063/5.0216084</identifier><identifier>CODEN: JAPIAU</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Alumina ; Aluminum oxide ; Casting ; Ceramics ; Conduction heating ; Heat conductivity ; Heat transfer ; Low temperature ; Porosity ; Power integrated circuits ; Pressing ; Sintering (powder metallurgy) ; Specific gravity ; Tape casting ; Thermal conductivity ; Thermal expansion</subject><ispartof>Journal of applied physics, 2024-10, Vol.136 (16)</ispartof><rights>Author(s)</rights><rights>2024 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c182t-43523210ded6c77ee55d8c48aaceeb4303864ac345602b3bd24309da4651cd8c3</cites><orcidid>0009-0002-3473-761X ; 0000-0002-4270-3324 ; 0009-0001-1865-7129 ; 0009-0007-0210-9009 ; 0009-0009-9974-052X ; 0009-0003-2632-2817 ; 0009-0004-3053-6487</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Lyu, Yang</creatorcontrib><creatorcontrib>Sun, Guoli</creatorcontrib><creatorcontrib>Ouyang, Xueqiong</creatorcontrib><creatorcontrib>Liu, Wencai</creatorcontrib><creatorcontrib>Liu, Qing</creatorcontrib><creatorcontrib>Shen, Yi</creatorcontrib><creatorcontrib>Wang, Shuangxi</creatorcontrib><title>Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate</title><title>Journal of applied physics</title><description>Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low thermal expansion coefficient, and excellent insulation properties. However, pores in the green tape from the tape casting process reduce the thermal conductivity and permittivity of the sintered ceramic substrate. Researchers have attempted to minimize ceramic porosity with chemical additives or by sintering pure alumina at temperatures above 1650 °C, but these methods often degrade thermal conductivity or quality of substrate evenness. This study proposes a low-cost casting-warm pressing process to densify pure alumina ceramic substrates using micro–nano-mixed alumina powders and sintering at relatively low temperatures. The results indicate that the relative density of the pure alumina ceramic substrate prepared at 1500 °C is 93%, a 4.4% improvement over the tape casting process. Additionally, the thermal conductivity of the alumina substrate from the casting-warm pressing process reaches 15.89 W/(m K), which is 1.4 times higher than that of the tape casting process. Microstructure analysis shows that the casting-warm pressing process with micro- and nano-multi-scale mixed alumina powders forms a novel thermal conduction enhancement mechanism. Large particles in the green tape overlap, while small particles fill the spaces between the large particles. The connected micrometer-sized particle skeletons form high thermal conduction net channels in the substrate, improving the thermal conductivity for heat transfer.</description><subject>Alumina</subject><subject>Aluminum oxide</subject><subject>Casting</subject><subject>Ceramics</subject><subject>Conduction heating</subject><subject>Heat conductivity</subject><subject>Heat transfer</subject><subject>Low temperature</subject><subject>Porosity</subject><subject>Power integrated circuits</subject><subject>Pressing</subject><subject>Sintering (powder metallurgy)</subject><subject>Specific gravity</subject><subject>Tape casting</subject><subject>Thermal conductivity</subject><subject>Thermal expansion</subject><issn>0021-8979</issn><issn>1089-7550</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2024</creationdate><recordtype>article</recordtype><recordid>eNp9kMtKAzEUhoMoWKsL32DAlcLU3CezLMVLodCNrkMmk9GUmaQmGaU738E39ElMadcuDuc_h-9c-AG4RnCGICf3bAYx4lDQEzBBUNRlxRg8BROY26Woq_ocXMS4gRAhQeoJ6Jau60fjtCl8V2gVk3Vv5ZcKQ7ENJsZcZeF1loV3RXo3-wiD6gvtXTvqZD9t2u2HB6uD__3-ccr5ct7jNSni2MQUVDKX4KxTfTRXxzwFr48PL4vncrV-Wi7mq1IjgVNJCcMEI9ialuuqMoaxVmgqlNLGNJRAIjhVmlDGIW5I0-Lcq1tFOUM6k2QKbg57888fo4lJbvwYXD4pCcJE1JxXOFO3Byo_HGMwndwGO6iwkwjKvY2SyaONmb07sFHbpJL17h_4D7Unc0w</recordid><startdate>20241028</startdate><enddate>20241028</enddate><creator>Lyu, Yang</creator><creator>Sun, Guoli</creator><creator>Ouyang, Xueqiong</creator><creator>Liu, Wencai</creator><creator>Liu, Qing</creator><creator>Shen, Yi</creator><creator>Wang, Shuangxi</creator><general>American Institute of Physics</general><scope>AJDQP</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><orcidid>https://orcid.org/0009-0002-3473-761X</orcidid><orcidid>https://orcid.org/0000-0002-4270-3324</orcidid><orcidid>https://orcid.org/0009-0001-1865-7129</orcidid><orcidid>https://orcid.org/0009-0007-0210-9009</orcidid><orcidid>https://orcid.org/0009-0009-9974-052X</orcidid><orcidid>https://orcid.org/0009-0003-2632-2817</orcidid><orcidid>https://orcid.org/0009-0004-3053-6487</orcidid></search><sort><creationdate>20241028</creationdate><title>Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate</title><author>Lyu, Yang ; Sun, Guoli ; Ouyang, Xueqiong ; Liu, Wencai ; Liu, Qing ; Shen, Yi ; Wang, Shuangxi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c182t-43523210ded6c77ee55d8c48aaceeb4303864ac345602b3bd24309da4651cd8c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2024</creationdate><topic>Alumina</topic><topic>Aluminum oxide</topic><topic>Casting</topic><topic>Ceramics</topic><topic>Conduction heating</topic><topic>Heat conductivity</topic><topic>Heat transfer</topic><topic>Low temperature</topic><topic>Porosity</topic><topic>Power integrated circuits</topic><topic>Pressing</topic><topic>Sintering (powder metallurgy)</topic><topic>Specific gravity</topic><topic>Tape casting</topic><topic>Thermal conductivity</topic><topic>Thermal expansion</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lyu, Yang</creatorcontrib><creatorcontrib>Sun, Guoli</creatorcontrib><creatorcontrib>Ouyang, Xueqiong</creatorcontrib><creatorcontrib>Liu, Wencai</creatorcontrib><creatorcontrib>Liu, Qing</creatorcontrib><creatorcontrib>Shen, Yi</creatorcontrib><creatorcontrib>Wang, Shuangxi</creatorcontrib><collection>AIP Open Access Journals</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of applied physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lyu, Yang</au><au>Sun, Guoli</au><au>Ouyang, Xueqiong</au><au>Liu, Wencai</au><au>Liu, Qing</au><au>Shen, Yi</au><au>Wang, Shuangxi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate</atitle><jtitle>Journal of applied physics</jtitle><date>2024-10-28</date><risdate>2024</risdate><volume>136</volume><issue>16</issue><issn>0021-8979</issn><eissn>1089-7550</eissn><coden>JAPIAU</coden><abstract>Alumina substrates are increasingly used for high-power integrated circuits due to their high thermal conductivity, low thermal expansion coefficient, and excellent insulation properties. However, pores in the green tape from the tape casting process reduce the thermal conductivity and permittivity of the sintered ceramic substrate. Researchers have attempted to minimize ceramic porosity with chemical additives or by sintering pure alumina at temperatures above 1650 °C, but these methods often degrade thermal conductivity or quality of substrate evenness. This study proposes a low-cost casting-warm pressing process to densify pure alumina ceramic substrates using micro–nano-mixed alumina powders and sintering at relatively low temperatures. The results indicate that the relative density of the pure alumina ceramic substrate prepared at 1500 °C is 93%, a 4.4% improvement over the tape casting process. Additionally, the thermal conductivity of the alumina substrate from the casting-warm pressing process reaches 15.89 W/(m K), which is 1.4 times higher than that of the tape casting process. Microstructure analysis shows that the casting-warm pressing process with micro- and nano-multi-scale mixed alumina powders forms a novel thermal conduction enhancement mechanism. Large particles in the green tape overlap, while small particles fill the spaces between the large particles. The connected micrometer-sized particle skeletons form high thermal conduction net channels in the substrate, improving the thermal conductivity for heat transfer.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/5.0216084</doi><tpages>11</tpages><orcidid>https://orcid.org/0009-0002-3473-761X</orcidid><orcidid>https://orcid.org/0000-0002-4270-3324</orcidid><orcidid>https://orcid.org/0009-0001-1865-7129</orcidid><orcidid>https://orcid.org/0009-0007-0210-9009</orcidid><orcidid>https://orcid.org/0009-0009-9974-052X</orcidid><orcidid>https://orcid.org/0009-0003-2632-2817</orcidid><orcidid>https://orcid.org/0009-0004-3053-6487</orcidid><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 0021-8979
ispartof Journal of applied physics, 2024-10, Vol.136 (16)
issn 0021-8979
1089-7550
language eng
recordid cdi_scitation_primary_10_1063_5_0216084
source Alma/SFX Local Collection
subjects Alumina
Aluminum oxide
Casting
Ceramics
Conduction heating
Heat conductivity
Heat transfer
Low temperature
Porosity
Power integrated circuits
Pressing
Sintering (powder metallurgy)
Specific gravity
Tape casting
Thermal conductivity
Thermal expansion
title Influence of casting-warm pressing process on the thermal conductivity of micro–nano-Al2O3 substrate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T00%3A08%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_scita&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Influence%20of%20casting-warm%20pressing%20process%20on%20the%20thermal%20conductivity%20of%20micro%E2%80%93nano-Al2O3%20substrate&rft.jtitle=Journal%20of%20applied%20physics&rft.au=Lyu,%20Yang&rft.date=2024-10-28&rft.volume=136&rft.issue=16&rft.issn=0021-8979&rft.eissn=1089-7550&rft.coden=JAPIAU&rft_id=info:doi/10.1063/5.0216084&rft_dat=%3Cproquest_scita%3E3123896672%3C/proquest_scita%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=3123896672&rft_id=info:pmid/&rfr_iscdi=true