Thermo-mechanical analysis of various solder materials via finite element method

The thermal environment may cause the unintended thermal stress to the solder joint which could lead to the reliability issue. This study aims to study the temperature cycling analysis of various solder materials (i.e., Sn-58Bi, Sn- 3.5Ag and Sn-9Zn) by using the finite element method. A leadless so...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Khor, C. Y., Termizi, S. N. A. Ahmad, Ishak, Muhammad Ikman, Hissam, M. I. B., Ani, F. Che
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Cycles Finite element analysis Finite element method Lead free Reliability analysis Soldered joints Strain Thermal environments Thermal stress Thermomechanical analysis Three dimensional models Tin base alloys
Online-Zugang:	Volltext
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