Cu-Cu low temperature bonding based on lead-free solder with graphene interlayer

In order to suppress the immoderate growth of intermetallic compounds (IMCs) at the Sn-Cu bonding interface, we transferred multilayer graphene between the Sn solder and the Cu film sample as an interlayer. Then, an external pressure of ∼350 N was applied to the two Cu film samples at 150 °C for 5 m...

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Veröffentlicht in:	Applied physics letters 2019-09, Vol.115 (12)
Hauptverfasser:	Yang, Wenhua, Zhou, Jie, Jiang, Xinyuan, Ye, Ximing, Xuan, Xiaofeng, Wu, Chunyan, Luo, Linbao
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Applied physics Bonding strength Copper Electric contacts Electrical properties External pressure Graphene Interface reactions Interlayers Intermetallic compounds Lead free Low temperature Multilayers Shear strength Thickness Tin Ultrasonic testing
Online-Zugang:	Volltext
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