Effect of bismuth on wettability of Sn-2.5Ag-0.5Cu-0.5Bi quaternary solder alloy on Cu substrate

This study reports the investigation on Bismuth (Bi) addition into Sn–3.0Ag-0.5Cu (SAC305) ternary lead-free solder to improves its various performances. The effects of Bi addition on the wettability of the solder alloy was studied. The results showed that when the addition of Bi was 0.5 wt.%, the c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Erer, Ahmet Mustafa, Oguz, Serkan
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Alloys Bismuth Contact angle Copper Intermetallic phases Lead free Melt temperature Quaternary alloys Sessile drop method Substrates Ternary alloys Tin Tin base alloys Wettability
Online-Zugang:	Volltext
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