Electrodeposition of nickel plates on copper substrates using PC y PRC

Electrodeposition processes using direct current (DC) require the use of additives to control deposit structure and properties as well as current distribution. The Pulse Current (PC) and Pulse Reverse Current (PRC) techniques improve the properties of deposits based on an appropriate selection of th...

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Veröffentlicht in:	Matéria 2007-12, Vol.12 (4), p.583-588
Hauptverfasser:	Aperador Chaparro, William Arnulfo, Lopez, Enrique Vera
Format:	Artikel
Sprache:	eng
Schlagworte:	CONSTRUCTION & BUILDING TECHNOLOGY MATERIALS SCIENCE, MULTIDISCIPLINARY METALLURGY & METALLURGICAL ENGINEERING
Online-Zugang:	Volltext
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