Thermal Spreading and Contact Resistance

Thermal Spreading and Contact Resistance: Fundamentals and ApplicationsSingle source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fieldsThermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensiv...

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Hauptverfasser: Yuri S. Muzychka, M. Michael Yovanovich
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description Thermal Spreading and Contact Resistance: Fundamentals and ApplicationsSingle source reference on how applying thermal spreading and contact resistance can solve problems across a variety of engineering fieldsThermal Spreading and Contact Resistance: Fundamentals and Applications offers comprehensive coverage of the key information that engineers need to know to understand thermal spreading and contact resistance, including numerous predictive models for determining thermal spreading resistance and contact conductance of mechanical joints and interfaces, plus detailed examples throughout the book. Written by two of the leading experts in the field, Thermal Spreading and Contact Resistance: Fundamentals and Applications includes information on: Contact conductance, mass transfer, transport from super-hydrophobic surfaces, droplet/surface phase change problems, and tribology applications such as sliding surfaces and roller bearingsHeat transfer in micro-devices and thermal spreaders, orthotropic systems, and multi-source applications for electronics thermal management applicationsFundamental principles, thermal spreading in isotropic half-space regions, circular flux tubes and disc spreaders, and rectangular flux channels and compound spreadersSystems with non-uniform sink plane conductance, transient spreading resistance, and contact resistance between both non-conforming and conforming rough surfacesProviding comprehensive coverage of the subject, Thermal Spreading and Contact Resistance: Fundamentals and Applications is an essential resource for mechanical, aerospace, and chemical engineers working on research in the fields of heat transfer, thermal management of electronics, and tribology, as well as thermal engineers and researchers in the field of thermal physics.
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