Synthesis, structure and reactivity of μ-SnH capped trinuclear nickel cluster
Treatment of the trichlorotin-capped trinuclear nickel cluster, [Ni 3 (dppm) 3 (μ 3 -Cl)(μ 3 -SnCl 3 )], 1 , with 4 eq. NaHB(Et) 3 yields a μ 3 -SnH capped trinuclear nickel cluster, [Ni 3 (dppm) 3 (μ 3 -H)(μ 3 -SnH)], 2 [dppm = bis(diphenylphosphino)methane]. Single-crystal X-ray diffraction, nucle...
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Veröffentlicht in: | Chemical science (Cambridge) 2022-10, Vol.13 (38), p.11382-11387 |
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Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Treatment of the trichlorotin-capped trinuclear nickel cluster, [Ni
3
(dppm)
3
(μ
3
-Cl)(μ
3
-SnCl
3
)],
1
, with 4 eq. NaHB(Et)
3
yields a μ
3
-SnH capped trinuclear nickel cluster, [Ni
3
(dppm)
3
(μ
3
-H)(μ
3
-SnH)],
2
[dppm = bis(diphenylphosphino)methane]. Single-crystal X-ray diffraction, nuclear magnetic resonance (NMR) spectroscopy, and computational studies together support that cluster
2
is a divalent tin hydride. Complex
2
displays a wide range of reactivity including oxidative addition of bromoethane across the Sn center. Addition of 1 eq. iodoethane to complex
2
releases H
2
(g) and generates an ethyltin-capped nickel cluster with a μ
3
-iodide, [Ni
3
(dppm)
3
(μ
3
-I)(μ
3
-Sn(CH
2
CH
3
))],
4
. Notably, insertion of alkynes into the Sn-H bond of
2
can be achieved
via
addition of 1 eq.
1
-hexyne to generate the 1-hexen-2-yl-tin-capped nickel cluster, [Ni
3
(dppm)
3
(μ
3
H)(μ
3
-Sn(C
6
H
11
))],
5
. Addition of H
2
(g) to
5
regenerates the starting material,
2
, and hexane. The formally 44-electron cluster
2
also displays significant redox chemistry with two reversible one-electron oxidations (
E
= −1.3 V, −0.8 V
vs.
Fc
0/+
) and one-electron reduction process (
E
= −2.7 V
vs.
Fc
0/+
) observed by cyclic voltammetry.
The synthesis, structure, and reactivity of a μ
3
-SnH capped trinuclear nickel cluster, [Ni
3
(dppm)
3
(μ
3
-H)(μ
3
-SnH)], is reported. This complex undergoes oxidative addition chemistry, alkyne insertion, and subsequent hydrogenation. |
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ISSN: | 2041-6520 2041-6539 |
DOI: | 10.1039/d2sc04042e |