Electrodeposition and characterization of copper nanocone structures
In this work, large-scale Cu nanocone arrays were synthesized by a one-step electrodeposition method without any template. The surface morphologies of Cu deposits prepared under different fabrication conditions have been observed. The as-prepared Cu nanocones grow preferentially along the direction....
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| Veröffentlicht in: | CrystEngComm 2015-01, Vol.17 (4), p.868-876 |
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| container_title | CrystEngComm |
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| creator | Deng, Yinping Ling, Huiqin Feng, Xue Hang, Tao Li, Ming |
| description | In this work, large-scale Cu nanocone arrays were synthesized by a one-step electrodeposition method without any template. The surface morphologies of Cu deposits prepared under different fabrication conditions have been observed. The as-prepared Cu nanocones grow preferentially along the direction. The formation mechanism of the nanocone structure can be explained by the screw dislocation driven growth theory. In addition, this electrodeposited Cu film with nanocone structure exhibits a superhydrophobic property after chemical modification.
This is the first time we have prepared a Cu nanocone structure by electrodeposition method without any template. |
| doi_str_mv | 10.1039/c4ce01993h |
| format | Article |
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This is the first time we have prepared a Cu nanocone structure by electrodeposition method without any template.</description><subject>Arrays</subject><subject>Copper</subject><subject>DEPOSITION</subject><subject>DISLOCATIONS</subject><subject>Electrodeposition</subject><subject>ELECTRODES</subject><subject>Formations</subject><subject>MICROSTRUCTURES</subject><subject>Morphology</subject><subject>Nanostructure</subject><subject>Screw dislocations</subject><issn>1466-8033</issn><issn>1466-8033</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNp90DFPwzAQBWALgUQpLOxIYUNIgXOcuM6I0kKRKrHAbLnnsxqUxsFOBvj1hBYBE8vd6enTDY-xcw43HER5izkS8LIUmwM24bmUqQIhDv_cx-wkxlcAnnMOEzZfNIR98JY6H-u-9m1iWpvgxgSDPYX6w-xC7xL0XUchaU3r0beUxD4M2A-B4ik7cqaJdPa9p-zlfvFcLdPV08NjdbdKUfCsTwkL6xC4manSSiVNPo7MKkS-FrNMSFgbqbBwZSZcVgBYKmcyBweknFVWTNnV_m8X_NtAsdfbOiI1jWnJD1FzWfBcQFGIkV7vKQYfYyCnu1BvTXjXHPRXVbrKq8WuquWIL_c4RPxxv1XqzrrRXPxnxCexTnHd</recordid><startdate>20150101</startdate><enddate>20150101</enddate><creator>Deng, Yinping</creator><creator>Ling, Huiqin</creator><creator>Feng, Xue</creator><creator>Hang, Tao</creator><creator>Li, Ming</creator><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20150101</creationdate><title>Electrodeposition and characterization of copper nanocone structures</title><author>Deng, Yinping ; Ling, Huiqin ; Feng, Xue ; Hang, Tao ; Li, Ming</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c312t-ec5dfc01a789d686a46862d8cc1b372360ba68c5f923f2500de97640f0e8fd8d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Arrays</topic><topic>Copper</topic><topic>DEPOSITION</topic><topic>DISLOCATIONS</topic><topic>Electrodeposition</topic><topic>ELECTRODES</topic><topic>Formations</topic><topic>MICROSTRUCTURES</topic><topic>Morphology</topic><topic>Nanostructure</topic><topic>Screw dislocations</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Deng, Yinping</creatorcontrib><creatorcontrib>Ling, Huiqin</creatorcontrib><creatorcontrib>Feng, Xue</creatorcontrib><creatorcontrib>Hang, Tao</creatorcontrib><creatorcontrib>Li, Ming</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>CrystEngComm</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Deng, Yinping</au><au>Ling, Huiqin</au><au>Feng, Xue</au><au>Hang, Tao</au><au>Li, Ming</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electrodeposition and characterization of copper nanocone structures</atitle><jtitle>CrystEngComm</jtitle><date>2015-01-01</date><risdate>2015</risdate><volume>17</volume><issue>4</issue><spage>868</spage><epage>876</epage><pages>868-876</pages><issn>1466-8033</issn><eissn>1466-8033</eissn><abstract>In this work, large-scale Cu nanocone arrays were synthesized by a one-step electrodeposition method without any template. The surface morphologies of Cu deposits prepared under different fabrication conditions have been observed. The as-prepared Cu nanocones grow preferentially along the direction. The formation mechanism of the nanocone structure can be explained by the screw dislocation driven growth theory. In addition, this electrodeposited Cu film with nanocone structure exhibits a superhydrophobic property after chemical modification.
This is the first time we have prepared a Cu nanocone structure by electrodeposition method without any template.</abstract><doi>10.1039/c4ce01993h</doi><tpages>9</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1466-8033 |
| ispartof | CrystEngComm, 2015-01, Vol.17 (4), p.868-876 |
| issn | 1466-8033 1466-8033 |
| language | eng |
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| source | Royal Society Of Chemistry Journals 2008-; Alma/SFX Local Collection |
| subjects | Arrays Copper DEPOSITION DISLOCATIONS Electrodeposition ELECTRODES Formations MICROSTRUCTURES Morphology Nanostructure Screw dislocations |
| title | Electrodeposition and characterization of copper nanocone structures |
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