Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards
The paper proposed an alternative optical metrology to classical methods (strain gauge measurements and numerical simulation) for strain determination on printed circuit board (PCBs) due to thermal loads. The digital image correlation (DIC) technique was employed to record the strain distribution in...
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| Veröffentlicht in: | Materials 2022-05, Vol.15 (11), p.3916 |
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| creator | Falk, Alexandru Pop, Octavian Dopeux, Jérôme Marsavina, Liviu |
| description | The paper proposed an alternative optical metrology to classical methods (strain gauge measurements and numerical simulation) for strain determination on printed circuit board (PCBs) due to thermal loads. The digital image correlation (DIC) technique was employed to record the strain distribution in some particular areas of the PCB. A thermal load was applied using a heating chamber, and the measurements were performed at four different temperature steps (25 °C, 50 °C, 85 °C and 120 °C). An increase in the principal strains with temperature was observed. For validation, the principal strains on the PCB obtained with DIC were compared with the values from gauge strain measurements and numerical simulation. The conclusions highlighted that DIC represents a technique with potential for strain measurement caused by thermal deformation, with the advantages of full field measurement, less preparation of the surface and good accuracy. |
| doi_str_mv | 10.3390/ma15113916 |
| format | Article |
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The digital image correlation (DIC) technique was employed to record the strain distribution in some particular areas of the PCB. A thermal load was applied using a heating chamber, and the measurements were performed at four different temperature steps (25 °C, 50 °C, 85 °C and 120 °C). An increase in the principal strains with temperature was observed. For validation, the principal strains on the PCB obtained with DIC were compared with the values from gauge strain measurements and numerical simulation. The conclusions highlighted that DIC represents a technique with potential for strain measurement caused by thermal deformation, with the advantages of full field measurement, less preparation of the surface and good accuracy.</description><identifier>ISSN: 1996-1944</identifier><identifier>EISSN: 1996-1944</identifier><identifier>DOI: 10.3390/ma15113916</identifier><identifier>PMID: 35683213</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Circuit boards ; Circuit components ; Circuit printing ; Comparative analysis ; Composite materials ; Data acquisition systems ; Deformation ; Digital cameras ; Digital imaging ; Finite element analysis ; Instrument industry ; Methods ; Numerical analysis ; Printed circuits ; Semiconductors ; Shear strain ; Simulation methods ; Software ; Strain distribution ; Strain gauges ; Strain measurement ; Thermal analysis ; Thermal expansion</subject><ispartof>Materials, 2022-05, Vol.15 (11), p.3916</ispartof><rights>COPYRIGHT 2022 MDPI AG</rights><rights>2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). 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The conclusions highlighted that DIC represents a technique with potential for strain measurement caused by thermal deformation, with the advantages of full field measurement, less preparation of the surface and good accuracy.</description><subject>Circuit boards</subject><subject>Circuit components</subject><subject>Circuit printing</subject><subject>Comparative analysis</subject><subject>Composite materials</subject><subject>Data acquisition systems</subject><subject>Deformation</subject><subject>Digital cameras</subject><subject>Digital imaging</subject><subject>Finite element analysis</subject><subject>Instrument industry</subject><subject>Methods</subject><subject>Numerical analysis</subject><subject>Printed circuits</subject><subject>Semiconductors</subject><subject>Shear strain</subject><subject>Simulation methods</subject><subject>Software</subject><subject>Strain distribution</subject><subject>Strain gauges</subject><subject>Strain measurement</subject><subject>Thermal analysis</subject><subject>Thermal expansion</subject><issn>1996-1944</issn><issn>1996-1944</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNpdkU1LxDAQhoMoKurFHyAFLyKsdjJNu7kI6-IXKArqOaRpopE2WZNW9N-bdf1ODhkyz7yZyUvINuQHiDw_7CQwAORQLpF14LwcAS-K5V_xGtmK8SlPCxHGlK-SNWTlGCngOrmaxKhj7LTrM2-y2z5I62J2E3wzKN1k9Vt296hDJ9vs5HUmXbTeZdYlwLo-5ac2qMH22bGXoYmbZMXINuqtz3OD3J-e3E3PR5fXZxfTyeVIYcX6EdYIhpqKK9ZQwwpeK9owlLyGgtVSMtOA5LmRVZXjmHNIuUIZyihVqUDhBjla6M6GutONSt0H2YpZsJ0Mb8JLK_5mnH0UD_5F8PQBWPAksPcpEPzzoGMvOhuVblvptB-ioGXFSmAM8oTu_kOf_BBcGm9OFVhBmc8FDxbUg2y1sM749K5Ku9GdVd5pY9P9pGI4Tq59FOwvClTwMQZtvruHXMydFT_OJnjn97zf6JeP-A4Kjp2w</recordid><startdate>20220531</startdate><enddate>20220531</enddate><creator>Falk, Alexandru</creator><creator>Pop, Octavian</creator><creator>Dopeux, Jérôme</creator><creator>Marsavina, Liviu</creator><general>MDPI AG</general><general>MDPI</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>7X8</scope><scope>5PM</scope></search><sort><creationdate>20220531</creationdate><title>Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards</title><author>Falk, Alexandru ; 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The digital image correlation (DIC) technique was employed to record the strain distribution in some particular areas of the PCB. A thermal load was applied using a heating chamber, and the measurements were performed at four different temperature steps (25 °C, 50 °C, 85 °C and 120 °C). An increase in the principal strains with temperature was observed. For validation, the principal strains on the PCB obtained with DIC were compared with the values from gauge strain measurements and numerical simulation. The conclusions highlighted that DIC represents a technique with potential for strain measurement caused by thermal deformation, with the advantages of full field measurement, less preparation of the surface and good accuracy.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>35683213</pmid><doi>10.3390/ma15113916</doi><oa>free_for_read</oa></addata></record> |
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| source | MDPI - Multidisciplinary Digital Publishing Institute; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; PubMed Central; Free Full-Text Journals in Chemistry; PubMed Central Open Access |
| subjects | Circuit boards Circuit components Circuit printing Comparative analysis Composite materials Data acquisition systems Deformation Digital cameras Digital imaging Finite element analysis Instrument industry Methods Numerical analysis Printed circuits Semiconductors Shear strain Simulation methods Software Strain distribution Strain gauges Strain measurement Thermal analysis Thermal expansion |
| title | Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards |
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