Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization
The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution...
Gespeichert in:
| Veröffentlicht in: | Materials 2021-11, Vol.14 (22), p.7028, Article 7028 |
|---|---|
| Hauptverfasser: | , , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | 22 |
| container_start_page | 7028 |
| container_title | Materials |
| container_volume | 14 |
| creator | Medvedev, Oleg S. Alyasova, Ekaterina E. Besprozvannaya, Rona E. Gadzhiev, Asadula A. Krivova, Veronika V. Kondratev, Andrey S. Kim, Artem E. Novikov, Pavel A. Popovich, Anatoliy A. |
| description | The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm(2) and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm(2). The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina. |
| doi_str_mv | 10.3390/ma14227028 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_pubme</sourceid><recordid>TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_8624961</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2604022784</sourcerecordid><originalsourceid>FETCH-LOGICAL-c383t-c30ae2787417b040ebbf2be5c0b510adc10409f6a83757e0d62bad9afbd7e2a33</originalsourceid><addsrcrecordid>eNqNkUtv1DAUhSMEolXphl8QiQ0CDfg1sbNBGkUFKhXBAtaRHzcdV4492A6oFT-eO51SHiu88PM7R_f6NM1TSl5x3pPXs6aCMUmYetAc077vVrQX4uEf-6PmtJQrgoNzqlj_uDniQnEmWHfc_DiPU1ggWmjT1G5CSNc-XrZnAWaItbQptnUL7QewWx291aH9lNMOcvVQbhUxOX8DDqXL7OMytzq6X6qN20LxeEBwSDuUoVHVIfgbXfH-SfNo0qHA6d160nx5e_Z5eL-6-PjufNhcrCxXvOJMNDCppKDSEEHAmIkZWFti1pRoZyle9lOnFZdrCcR1zGjX68k4CUxzftK8OfjuFjODs9hZ1mHcZT_rfD0m7ce_X6Lfjpfp26g6JvqOosHzO4Ocvi5Q6jj7YiEEHSEtZWQdVoApKIHos3_Qq7TkiO3tKUYFXzOF1IsDZXMqJcN0Xwwl4z7X8XeuCKsD_B1Mmor1-7juBZirZLKXVO4jpoOvt387pCVWlL78fyn_CcSythw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2602143528</pqid></control><display><type>article</type><title>Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization</title><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><source>PubMed Central Open Access</source><source>MDPI - Multidisciplinary Digital Publishing Institute</source><source>Web of Science - Science Citation Index Expanded - 2021<img src="https://exlibris-pub.s3.amazonaws.com/fromwos-v2.jpg" /></source><source>PubMed Central</source><source>Free Full-Text Journals in Chemistry</source><creator>Medvedev, Oleg S. ; Alyasova, Ekaterina E. ; Besprozvannaya, Rona E. ; Gadzhiev, Asadula A. ; Krivova, Veronika V. ; Kondratev, Andrey S. ; Kim, Artem E. ; Novikov, Pavel A. ; Popovich, Anatoliy A.</creator><creatorcontrib>Medvedev, Oleg S. ; Alyasova, Ekaterina E. ; Besprozvannaya, Rona E. ; Gadzhiev, Asadula A. ; Krivova, Veronika V. ; Kondratev, Andrey S. ; Kim, Artem E. ; Novikov, Pavel A. ; Popovich, Anatoliy A.</creatorcontrib><description>The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm(2) and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm(2). The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina.</description><identifier>ISSN: 1996-1944</identifier><identifier>EISSN: 1996-1944</identifier><identifier>DOI: 10.3390/ma14227028</identifier><identifier>PMID: 34832426</identifier><language>eng</language><publisher>BASEL: Mdpi</publisher><subject>Adhesion ; Adhesives ; Alloying elements ; Alloys ; Aluminum alloys ; Aluminum base alloys ; Aluminum oxide ; Anodizing ; Ceramics ; Chemical elements ; Chemistry ; Chemistry, Physical ; Copper ; Electric vehicles ; Experiments ; Hardness ; Heat conductivity ; Manufacturers ; Materials Science ; Materials Science, Multidisciplinary ; Mechanical properties ; Metallizing ; Metallurgy & Metallurgical Engineering ; Modules ; Morphology ; Peel tests ; Physical Sciences ; Physics ; Physics, Applied ; Physics, Condensed Matter ; Polymerization ; Pricing ; Science & Technology ; Substrates ; Surface hardness ; Technology ; Thermal cycling ; Topology ; Transistors ; Trends</subject><ispartof>Materials, 2021-11, Vol.14 (22), p.7028, Article 7028</ispartof><rights>2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><rights>2021 by the authors. 2021</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>true</woscitedreferencessubscribed><woscitedreferencescount>2</woscitedreferencescount><woscitedreferencesoriginalsourcerecordid>wos000727971700001</woscitedreferencesoriginalsourcerecordid><citedby>FETCH-LOGICAL-c383t-c30ae2787417b040ebbf2be5c0b510adc10409f6a83757e0d62bad9afbd7e2a33</citedby><cites>FETCH-LOGICAL-c383t-c30ae2787417b040ebbf2be5c0b510adc10409f6a83757e0d62bad9afbd7e2a33</cites><orcidid>0000-0002-2052-363X ; 0000-0002-9748-6910</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624961/pdf/$$EPDF$$P50$$Gpubmedcentral$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC8624961/$$EHTML$$P50$$Gpubmedcentral$$Hfree_for_read</linktohtml><link.rule.ids>230,315,728,781,785,886,27929,27930,39263,53796,53798</link.rule.ids></links><search><creatorcontrib>Medvedev, Oleg S.</creatorcontrib><creatorcontrib>Alyasova, Ekaterina E.</creatorcontrib><creatorcontrib>Besprozvannaya, Rona E.</creatorcontrib><creatorcontrib>Gadzhiev, Asadula A.</creatorcontrib><creatorcontrib>Krivova, Veronika V.</creatorcontrib><creatorcontrib>Kondratev, Andrey S.</creatorcontrib><creatorcontrib>Kim, Artem E.</creatorcontrib><creatorcontrib>Novikov, Pavel A.</creatorcontrib><creatorcontrib>Popovich, Anatoliy A.</creatorcontrib><title>Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization</title><title>Materials</title><addtitle>MATERIALS</addtitle><description>The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm(2) and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm(2). The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina.</description><subject>Adhesion</subject><subject>Adhesives</subject><subject>Alloying elements</subject><subject>Alloys</subject><subject>Aluminum alloys</subject><subject>Aluminum base alloys</subject><subject>Aluminum oxide</subject><subject>Anodizing</subject><subject>Ceramics</subject><subject>Chemical elements</subject><subject>Chemistry</subject><subject>Chemistry, Physical</subject><subject>Copper</subject><subject>Electric vehicles</subject><subject>Experiments</subject><subject>Hardness</subject><subject>Heat conductivity</subject><subject>Manufacturers</subject><subject>Materials Science</subject><subject>Materials Science, Multidisciplinary</subject><subject>Mechanical properties</subject><subject>Metallizing</subject><subject>Metallurgy & Metallurgical Engineering</subject><subject>Modules</subject><subject>Morphology</subject><subject>Peel tests</subject><subject>Physical Sciences</subject><subject>Physics</subject><subject>Physics, Applied</subject><subject>Physics, Condensed Matter</subject><subject>Polymerization</subject><subject>Pricing</subject><subject>Science & Technology</subject><subject>Substrates</subject><subject>Surface hardness</subject><subject>Technology</subject><subject>Thermal cycling</subject><subject>Topology</subject><subject>Transistors</subject><subject>Trends</subject><issn>1996-1944</issn><issn>1996-1944</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>HGBXW</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNqNkUtv1DAUhSMEolXphl8QiQ0CDfg1sbNBGkUFKhXBAtaRHzcdV4492A6oFT-eO51SHiu88PM7R_f6NM1TSl5x3pPXs6aCMUmYetAc077vVrQX4uEf-6PmtJQrgoNzqlj_uDniQnEmWHfc_DiPU1ggWmjT1G5CSNc-XrZnAWaItbQptnUL7QewWx291aH9lNMOcvVQbhUxOX8DDqXL7OMytzq6X6qN20LxeEBwSDuUoVHVIfgbXfH-SfNo0qHA6d160nx5e_Z5eL-6-PjufNhcrCxXvOJMNDCppKDSEEHAmIkZWFti1pRoZyle9lOnFZdrCcR1zGjX68k4CUxzftK8OfjuFjODs9hZ1mHcZT_rfD0m7ce_X6Lfjpfp26g6JvqOosHzO4Ocvi5Q6jj7YiEEHSEtZWQdVoApKIHos3_Qq7TkiO3tKUYFXzOF1IsDZXMqJcN0Xwwl4z7X8XeuCKsD_B1Mmor1-7juBZirZLKXVO4jpoOvt387pCVWlL78fyn_CcSythw</recordid><startdate>20211119</startdate><enddate>20211119</enddate><creator>Medvedev, Oleg S.</creator><creator>Alyasova, Ekaterina E.</creator><creator>Besprozvannaya, Rona E.</creator><creator>Gadzhiev, Asadula A.</creator><creator>Krivova, Veronika V.</creator><creator>Kondratev, Andrey S.</creator><creator>Kim, Artem E.</creator><creator>Novikov, Pavel A.</creator><creator>Popovich, Anatoliy A.</creator><general>Mdpi</general><general>MDPI AG</general><general>MDPI</general><scope>BLEPL</scope><scope>DTL</scope><scope>HGBXW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>7X8</scope><scope>5PM</scope><orcidid>https://orcid.org/0000-0002-2052-363X</orcidid><orcidid>https://orcid.org/0000-0002-9748-6910</orcidid></search><sort><creationdate>20211119</creationdate><title>Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization</title><author>Medvedev, Oleg S. ; Alyasova, Ekaterina E. ; Besprozvannaya, Rona E. ; Gadzhiev, Asadula A. ; Krivova, Veronika V. ; Kondratev, Andrey S. ; Kim, Artem E. ; Novikov, Pavel A. ; Popovich, Anatoliy A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c383t-c30ae2787417b040ebbf2be5c0b510adc10409f6a83757e0d62bad9afbd7e2a33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Adhesion</topic><topic>Adhesives</topic><topic>Alloying elements</topic><topic>Alloys</topic><topic>Aluminum alloys</topic><topic>Aluminum base alloys</topic><topic>Aluminum oxide</topic><topic>Anodizing</topic><topic>Ceramics</topic><topic>Chemical elements</topic><topic>Chemistry</topic><topic>Chemistry, Physical</topic><topic>Copper</topic><topic>Electric vehicles</topic><topic>Experiments</topic><topic>Hardness</topic><topic>Heat conductivity</topic><topic>Manufacturers</topic><topic>Materials Science</topic><topic>Materials Science, Multidisciplinary</topic><topic>Mechanical properties</topic><topic>Metallizing</topic><topic>Metallurgy & Metallurgical Engineering</topic><topic>Modules</topic><topic>Morphology</topic><topic>Peel tests</topic><topic>Physical Sciences</topic><topic>Physics</topic><topic>Physics, Applied</topic><topic>Physics, Condensed Matter</topic><topic>Polymerization</topic><topic>Pricing</topic><topic>Science & Technology</topic><topic>Substrates</topic><topic>Surface hardness</topic><topic>Technology</topic><topic>Thermal cycling</topic><topic>Topology</topic><topic>Transistors</topic><topic>Trends</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Medvedev, Oleg S.</creatorcontrib><creatorcontrib>Alyasova, Ekaterina E.</creatorcontrib><creatorcontrib>Besprozvannaya, Rona E.</creatorcontrib><creatorcontrib>Gadzhiev, Asadula A.</creatorcontrib><creatorcontrib>Krivova, Veronika V.</creatorcontrib><creatorcontrib>Kondratev, Andrey S.</creatorcontrib><creatorcontrib>Kim, Artem E.</creatorcontrib><creatorcontrib>Novikov, Pavel A.</creatorcontrib><creatorcontrib>Popovich, Anatoliy A.</creatorcontrib><collection>Web of Science Core Collection</collection><collection>Science Citation Index Expanded</collection><collection>Web of Science - Science Citation Index Expanded - 2021</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><jtitle>Materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Medvedev, Oleg S.</au><au>Alyasova, Ekaterina E.</au><au>Besprozvannaya, Rona E.</au><au>Gadzhiev, Asadula A.</au><au>Krivova, Veronika V.</au><au>Kondratev, Andrey S.</au><au>Kim, Artem E.</au><au>Novikov, Pavel A.</au><au>Popovich, Anatoliy A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization</atitle><jtitle>Materials</jtitle><stitle>MATERIALS</stitle><date>2021-11-19</date><risdate>2021</risdate><volume>14</volume><issue>22</issue><spage>7028</spage><pages>7028-</pages><artnum>7028</artnum><issn>1996-1944</issn><eissn>1996-1944</eissn><abstract>The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm(2) and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm(2). The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina.</abstract><cop>BASEL</cop><pub>Mdpi</pub><pmid>34832426</pmid><doi>10.3390/ma14227028</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0002-2052-363X</orcidid><orcidid>https://orcid.org/0000-0002-9748-6910</orcidid><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 1996-1944 |
| ispartof | Materials, 2021-11, Vol.14 (22), p.7028, Article 7028 |
| issn | 1996-1944 1996-1944 |
| language | eng |
| recordid | cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_8624961 |
| source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; PubMed Central Open Access; MDPI - Multidisciplinary Digital Publishing Institute; Web of Science - Science Citation Index Expanded - 2021<img src="https://exlibris-pub.s3.amazonaws.com/fromwos-v2.jpg" />; PubMed Central; Free Full-Text Journals in Chemistry |
| subjects | Adhesion Adhesives Alloying elements Alloys Aluminum alloys Aluminum base alloys Aluminum oxide Anodizing Ceramics Chemical elements Chemistry Chemistry, Physical Copper Electric vehicles Experiments Hardness Heat conductivity Manufacturers Materials Science Materials Science, Multidisciplinary Mechanical properties Metallizing Metallurgy & Metallurgical Engineering Modules Morphology Peel tests Physical Sciences Physics Physics, Applied Physics, Condensed Matter Polymerization Pricing Science & Technology Substrates Surface hardness Technology Thermal cycling Topology Transistors Trends |
| title | Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T15%3A51%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pubme&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Influence%20of%20Alloying%20Elements%20on%20the%20Mechanical%20Properties%20of%20Anodized%20Aluminum%20and%20on%20the%20Adhesion%20of%20Copper%20Metallization&rft.jtitle=Materials&rft.au=Medvedev,%20Oleg%20S.&rft.date=2021-11-19&rft.volume=14&rft.issue=22&rft.spage=7028&rft.pages=7028-&rft.artnum=7028&rft.issn=1996-1944&rft.eissn=1996-1944&rft_id=info:doi/10.3390/ma14227028&rft_dat=%3Cproquest_pubme%3E2604022784%3C/proquest_pubme%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2602143528&rft_id=info:pmid/34832426&rfr_iscdi=true |