Soldering of Electronics Components on 3D-Printed Conductive Substrates

Rapid development of additive manufacturing and new composites materials with unique properties are promising tools for fabricating structural electronics. However, according to the typical maximum resolution of additive manufacturing methods, there is no possibility to fabricate all electrical comp...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Materials 2021-07, Vol.14 (14), p.3850
Hauptverfasser:	Podsiadły, Bartłomiej, Skalski, Andrzej, Słoma, Marcin
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D printers Additive manufacturing Adhesives Alloys Circuits Composite materials Contact angle Electric components Electric contacts Electronic circuits Electronic components Electronics High temperature Low temperature Mechanical cleaning Mechanical properties Methods Particle size Polymers Production methods Rapid prototyping Reflow soldering Shear forces Shear strength Soldered joints Solders Solvents Substrates Surface preparation Three dimensional composites Three dimensional printing
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!