Investigation of the Relationship between Morphology and Thermal Conductivity of Powder Metallurgically Prepared Aluminium Foams

Among different promising solutions, coupling closed-cell aluminium foam composite panels prepared by a powder metallurgical method with pore walls interconnected by microcracks, with low thermal conductivity phase change materials (PCMs), is one of the effective ways of increasing thermal conductivity for better performance of thermal storage systems in buildings. The internal structure of the foam formation, related to the porosity which decides the heat transfer rate, plays a significant role in the thermal energy storage performance. The dependence of the heat transfer characteristics on the internal foam structure is studied numerically in this work. The foamable precursor of 99.7% pure aluminium powder mixed with 0.15 wt.% of foaming agent, TiH2 powder, was prepared by compacting, and extruded to a volume of 20 × 40 × 5 mm. Two aluminium foam samples of 40 × 40 × 5 mm were examined with apparent densities of 0.7415 g/cm3 and 1.62375 g/cm3. The internal porous structure of the aluminium foam samples was modelled using X-ray tomography slices through image processing techniques for finite element analysis. The obtained numerical results for the heat transfer rate and effective thermal conductivity of the developed surrogate models revealed the influence of porosity, struts, and the presence of pore walls in determining the heat flow in the internal structure of the foam. Additionally, it was found that the pore size and its distribution determine the uniform heat flow rate in the entire foamed structure. The numerical data were then validated against the analytical predictions of thermal conductivity based on various correlations. It has been found that the simplified models of Bruggemann and Russell and the parallel–series model can predict the excellent effective thermal conductivity results of the foam throughout the porosity range. The optimal internal foam structure was studied to explore the possibilities of using aluminium foam for PCM-based thermal storage applications.