Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps

Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps

In this work, we demonstrate on a new interconnection technology which can be used for bonding Flip-Chips with 5-µm-Bumps and fine pitches

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Bibliographische Detailangaben
Veröffentlicht in:Journal of materials engineering and performance 2021-05, Vol.30 (5), p.3173-3177
Hauptverfasser: Roustaie, F., Quednau, S., Weißenborn, F., Birlem, O.
Format: Artikel
Sprache:eng
Schlagworte:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Corrosion and Coatings
Engineering Design
Materials Science
Quality Control
Reliability
Safety and Risk
Tribology
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Beschreibung
Zusammenfassung:In this work, we demonstrate on a new interconnection technology which can be used for bonding Flip-Chips with 5-µm-Bumps and fine pitches
ISSN:1059-9495
1544-1024
DOI:10.1007/s11665-021-05649-9