Development of Na0.5CoO2 Thick Film Prepared by Screen-Printing Process
The Na0.5Co0.9Cu0.1O2 thick film with the same thermoelectric performance as a Na0.5CoO2 bulk was formed on an alumina substrate by the screen-printing process. The power factor exceeded 0.3 mW/K2m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film without any cracks s...
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| Veröffentlicht in: | Materials 2020-06, Vol.13 (12), p.2805 |
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| creator | Tsuruta, Akihiro Tanaka, Miki Mikami, Masashi Kinemuchi, Yoshiaki Masuda, Yoshitake Shin, Woosuck Terasaki, Ichiro |
| description | The Na0.5Co0.9Cu0.1O2 thick film with the same thermoelectric performance as a Na0.5CoO2 bulk was formed on an alumina substrate by the screen-printing process. The power factor exceeded 0.3 mW/K2m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film without any cracks strongly adhered to the substrate. The high-quality thick film had been realized through the carefully designed and improved process, mixing NaCl to promote the anisotropic sintering of Na0.5Co0.9Cu0.1O2, inserting a CuO interlayer to adhere the film and substrate, and Co–Cu substituting Cu for Co to control the sintering temperature. |
| doi_str_mv | 10.3390/ma13122805 |
| format | Article |
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The power factor exceeded 0.3 mW/K2m, with the resistivity of 3.8 mΩcm and the thermopower of 108 μV/K. The thick film without any cracks strongly adhered to the substrate. The high-quality thick film had been realized through the carefully designed and improved process, mixing NaCl to promote the anisotropic sintering of Na0.5Co0.9Cu0.1O2, inserting a CuO interlayer to adhere the film and substrate, and Co–Cu substituting Cu for Co to control the sintering temperature.</description><identifier>ISSN: 1996-1944</identifier><identifier>EISSN: 1996-1944</identifier><identifier>DOI: 10.3390/ma13122805</identifier><identifier>PMID: 32580332</identifier><language>eng</language><publisher>Basel: MDPI AG</publisher><subject>Aluminum oxide ; Cracks ; Decomposition ; Heat ; Interlayers ; Power factor ; Screen printing ; Sintering ; Substrates</subject><ispartof>Materials, 2020-06, Vol.13 (12), p.2805</ispartof><rights>2020. 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| subjects | Aluminum oxide Cracks Decomposition Heat Interlayers Power factor Screen printing Sintering Substrates |
| title | Development of Na0.5CoO2 Thick Film Prepared by Screen-Printing Process |
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