Tensile Properties of -Oriented Nanotwinned Cu with Different Columnar Grain Structures
We performed tensile tests on highly -oriented nanotwinned copper (nt-Cu) foils with different columnar grain structures. For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temperatures under a nitrogen atmosphere. The results sh...
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| creator | Li, Yu-Jin Tu, King-Ning Chen, Chih |
| description | We performed tensile tests on highly -oriented nanotwinned copper (nt-Cu) foils with different columnar grain structures. For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temperatures under a nitrogen atmosphere. The results show that the yield strength ranges from 300 to 700 MPa, and elongation spans from 5% to 25%. Knowing the measured twin spacing and average grain size, and combining the confined layer slip with the Hall-Petch equation, we calculated the theoretical yield strength of the nt-Cu with different microstructures, and the theoretic values match the experiment results. Owing to the unique crystal orientation properties of -oriented columnar grains, dislocations induced by slip are very limited. The Schmid factor of grains along the tensile axis direction is highly identical, so the plastic deformation is much more suitably explained by the Schmid factor model. Thus, we replace the Taylor factor with the Schmid factor in the slip model of nt-Cu. |
| doi_str_mv | 10.3390/ma13061310 |
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For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temperatures under a nitrogen atmosphere. The results show that the yield strength ranges from 300 to 700 MPa, and elongation spans from 5% to 25%. Knowing the measured twin spacing and average grain size, and combining the confined layer slip with the Hall-Petch equation, we calculated the theoretical yield strength of the nt-Cu with different microstructures, and the theoretic values match the experiment results. Owing to the unique crystal orientation properties of -oriented columnar grains, dislocations induced by slip are very limited. The Schmid factor of grains along the tensile axis direction is highly identical, so the plastic deformation is much more suitably explained by the Schmid factor model. Thus, we replace the Taylor factor with the Schmid factor in the slip model of nt-Cu.</description><identifier>ISSN: 1996-1944</identifier><identifier>EISSN: 1996-1944</identifier><identifier>DOI: 10.3390/ma13061310</identifier><identifier>PMID: 32183126</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Additives ; Copper ; Crystal structure ; Dislocations ; Ductility ; Electroplating ; Elongation ; Foils ; Grain boundaries ; Grain size ; Mechanical properties ; Plastic deformation ; Slip ; Tensile properties ; Tensile tests ; Thermal cycling ; Yield strength ; Yield stress</subject><ispartof>Materials, 2020-03, Vol.13 (6), p.1310</ispartof><rights>2020. This work is licensed under http://creativecommons.org/licenses/by/3.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><rights>2020 by the authors. 2020</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3210-5824d5a341150a6b4eeee5f931d41e51cd0425d6f4cd81bce56e158bf7ae5bee3</citedby><cites>FETCH-LOGICAL-c3210-5824d5a341150a6b4eeee5f931d41e51cd0425d6f4cd81bce56e158bf7ae5bee3</cites><orcidid>0000-0001-6235-2827</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC7143352/pdf/$$EPDF$$P50$$Gpubmedcentral$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC7143352/$$EHTML$$P50$$Gpubmedcentral$$Hfree_for_read</linktohtml><link.rule.ids>230,314,723,776,780,881,27901,27902,53766,53768</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/32183126$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Li, Yu-Jin</creatorcontrib><creatorcontrib>Tu, King-Ning</creatorcontrib><creatorcontrib>Chen, Chih</creatorcontrib><title>Tensile Properties of -Oriented Nanotwinned Cu with Different Columnar Grain Structures</title><title>Materials</title><addtitle>Materials (Basel)</addtitle><description>We performed tensile tests on highly -oriented nanotwinned copper (nt-Cu) foils with different columnar grain structures. For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temperatures under a nitrogen atmosphere. The results show that the yield strength ranges from 300 to 700 MPa, and elongation spans from 5% to 25%. Knowing the measured twin spacing and average grain size, and combining the confined layer slip with the Hall-Petch equation, we calculated the theoretical yield strength of the nt-Cu with different microstructures, and the theoretic values match the experiment results. Owing to the unique crystal orientation properties of -oriented columnar grains, dislocations induced by slip are very limited. The Schmid factor of grains along the tensile axis direction is highly identical, so the plastic deformation is much more suitably explained by the Schmid factor model. Thus, we replace the Taylor factor with the Schmid factor in the slip model of nt-Cu.</description><subject>Additives</subject><subject>Copper</subject><subject>Crystal structure</subject><subject>Dislocations</subject><subject>Ductility</subject><subject>Electroplating</subject><subject>Elongation</subject><subject>Foils</subject><subject>Grain boundaries</subject><subject>Grain size</subject><subject>Mechanical properties</subject><subject>Plastic deformation</subject><subject>Slip</subject><subject>Tensile properties</subject><subject>Tensile tests</subject><subject>Thermal cycling</subject><subject>Yield strength</subject><subject>Yield stress</subject><issn>1996-1944</issn><issn>1996-1944</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNpdkUtLxTAQhYMoKurGHyABNyJUM03Sm24EuT5BVFBxGdJ2qpE2uSat4r83vh-zmYHzcTjDIWQd2A7nJdvtDXBWAAc2R5ahLIsMSiHmf91LZC3GB5aGc1B5uUiWeA6KQ14sk9trdNF2SC-Dn2EYLEbqW5pdBItuwIaeG-eHZ-tcuqcjfbbDPT2wbYsh6XTqu7F3JtDjYKyjV0MY62EMGFfJQmu6iGufe4XcHB1eT0-ys4vj0-n-WVanDCyTKheNNFwASGaKSmAa2ZYcGgEooW6YyGVTtKJuFFQ1ygJBqqqdGJQVIl8hex--s7HqsalTqGA6PQu2N-FFe2P1X8XZe33nn_QEBOcyTwZbnwbBP44YB93bWGPXGYd-jDrnE6VUwXiZ0M1_6IMfg0vvvVOClYVSidr-oOrgYwzYfocBpt8q0z-VJXjjd_xv9Ksg_gqdGJHc</recordid><startdate>20200313</startdate><enddate>20200313</enddate><creator>Li, Yu-Jin</creator><creator>Tu, King-Ning</creator><creator>Chen, Chih</creator><general>MDPI AG</general><general>MDPI</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>7X8</scope><scope>5PM</scope><orcidid>https://orcid.org/0000-0001-6235-2827</orcidid></search><sort><creationdate>20200313</creationdate><title>Tensile Properties of -Oriented Nanotwinned Cu with Different Columnar Grain Structures</title><author>Li, Yu-Jin ; Tu, King-Ning ; Chen, Chih</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3210-5824d5a341150a6b4eeee5f931d41e51cd0425d6f4cd81bce56e158bf7ae5bee3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Additives</topic><topic>Copper</topic><topic>Crystal structure</topic><topic>Dislocations</topic><topic>Ductility</topic><topic>Electroplating</topic><topic>Elongation</topic><topic>Foils</topic><topic>Grain boundaries</topic><topic>Grain size</topic><topic>Mechanical properties</topic><topic>Plastic deformation</topic><topic>Slip</topic><topic>Tensile properties</topic><topic>Tensile tests</topic><topic>Thermal cycling</topic><topic>Yield strength</topic><topic>Yield stress</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Li, Yu-Jin</creatorcontrib><creatorcontrib>Tu, King-Ning</creatorcontrib><creatorcontrib>Chen, Chih</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><jtitle>Materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Li, Yu-Jin</au><au>Tu, King-Ning</au><au>Chen, Chih</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Tensile Properties of -Oriented Nanotwinned Cu with Different Columnar Grain Structures</atitle><jtitle>Materials</jtitle><addtitle>Materials (Basel)</addtitle><date>2020-03-13</date><risdate>2020</risdate><volume>13</volume><issue>6</issue><spage>1310</spage><pages>1310-</pages><issn>1996-1944</issn><eissn>1996-1944</eissn><abstract>We performed tensile tests on highly -oriented nanotwinned copper (nt-Cu) foils with different columnar grain structures. For a systematic study, we altered the microstructure of the foils by tuning the electroplating electrolyte and annealing temperatures under a nitrogen atmosphere. The results show that the yield strength ranges from 300 to 700 MPa, and elongation spans from 5% to 25%. Knowing the measured twin spacing and average grain size, and combining the confined layer slip with the Hall-Petch equation, we calculated the theoretical yield strength of the nt-Cu with different microstructures, and the theoretic values match the experiment results. Owing to the unique crystal orientation properties of -oriented columnar grains, dislocations induced by slip are very limited. The Schmid factor of grains along the tensile axis direction is highly identical, so the plastic deformation is much more suitably explained by the Schmid factor model. Thus, we replace the Taylor factor with the Schmid factor in the slip model of nt-Cu.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>32183126</pmid><doi>10.3390/ma13061310</doi><orcidid>https://orcid.org/0000-0001-6235-2827</orcidid><oa>free_for_read</oa></addata></record> |
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| source | MDPI - Multidisciplinary Digital Publishing Institute; EZB-FREE-00999 freely available EZB journals; PubMed Central; Free Full-Text Journals in Chemistry; PubMed Central Open Access |
| subjects | Additives Copper Crystal structure Dislocations Ductility Electroplating Elongation Foils Grain boundaries Grain size Mechanical properties Plastic deformation Slip Tensile properties Tensile tests Thermal cycling Yield strength Yield stress |
| title | Tensile Properties of -Oriented Nanotwinned Cu with Different Columnar Grain Structures |
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