Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser
High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decreas...
Gespeichert in:
| Veröffentlicht in: | Polymers 2018-12, Vol.10 (12), p.1390 |
|---|---|
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | 12 |
| container_start_page | 1390 |
| container_title | Polymers |
| container_volume | 10 |
| creator | Zhao, Wanqin Wang, Lingzhi |
| description | High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0~2 µm could be successfully drilled in FPCs using ultrashort pulse laser. |
| doi_str_mv | 10.3390/polym10121390 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_pubme</sourceid><recordid>TN_cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_6401753</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2582836619</sourcerecordid><originalsourceid>FETCH-LOGICAL-c415t-344edf775cd3a3c80e558cd598ab7bf2b6caee29585c4ba109fdac712afe3e9f3</originalsourceid><addsrcrecordid>eNpdkU1LAzEQhoMoKtWjVwl48bKaj81-XAQpVoWKPbTnkM3OdiPppia7Yv-9KWqp5jIZ5pmXmXkRuqDkhvOS3K6d3awooYzG7ACdMpLzJOUZOdz7n6DzEN5IfKnIMpofoxNOyoxyKk6RfjHau9oba023xK7B89a7YdkmT85CwKbDEwufprKAZ950PdR4bLweTB_wImx7Zka7ANp1NV7Y3qvQOt_j2WAD4KkK4M_QUaNidv4TR2gxeZiPn5Lp6-Pz-H6a6JSKPuFpCnWT50LXXHFdEBCi0LUoC1XlVcOqTCsAVopC6LRSlJRNrXROmWqAQ9nwEbr71l0P1QpqDV2cxsq1NyvlN9IpI_9WOtPKpfuQWUpoLngUuP4R8O59gNDLlQkarFUduCFIxkjGWFlwGtGrf-ibG3wX15NMFKzg8dJlpJJvKt44BA_NbhhK5NZB-cfByF_ub7Cjf_3iXwcamd0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2582836619</pqid></control><display><type>article</type><title>Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser</title><source>PubMed Central Open Access</source><source>MDPI - Multidisciplinary Digital Publishing Institute</source><source>EZB-FREE-00999 freely available EZB journals</source><source>PubMed Central</source><creator>Zhao, Wanqin ; Wang, Lingzhi</creator><creatorcontrib>Zhao, Wanqin ; Wang, Lingzhi</creatorcontrib><description>High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0~2 µm could be successfully drilled in FPCs using ultrashort pulse laser.</description><identifier>ISSN: 2073-4360</identifier><identifier>EISSN: 2073-4360</identifier><identifier>DOI: 10.3390/polym10121390</identifier><identifier>PMID: 30961315</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Ablation ; Composite materials ; Density ; Dielectric properties ; Drilling ; Energy ; Experiments ; Lasers ; Microdrilling ; Morphology ; Printed circuit boards ; Printed circuits ; Process parameters</subject><ispartof>Polymers, 2018-12, Vol.10 (12), p.1390</ispartof><rights>2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><rights>2018 by the authors. 2018</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c415t-344edf775cd3a3c80e558cd598ab7bf2b6caee29585c4ba109fdac712afe3e9f3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401753/pdf/$$EPDF$$P50$$Gpubmedcentral$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401753/$$EHTML$$P50$$Gpubmedcentral$$Hfree_for_read</linktohtml><link.rule.ids>230,314,727,780,784,885,27923,27924,53790,53792</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/30961315$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Zhao, Wanqin</creatorcontrib><creatorcontrib>Wang, Lingzhi</creatorcontrib><title>Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser</title><title>Polymers</title><addtitle>Polymers (Basel)</addtitle><description>High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0~2 µm could be successfully drilled in FPCs using ultrashort pulse laser.</description><subject>Ablation</subject><subject>Composite materials</subject><subject>Density</subject><subject>Dielectric properties</subject><subject>Drilling</subject><subject>Energy</subject><subject>Experiments</subject><subject>Lasers</subject><subject>Microdrilling</subject><subject>Morphology</subject><subject>Printed circuit boards</subject><subject>Printed circuits</subject><subject>Process parameters</subject><issn>2073-4360</issn><issn>2073-4360</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNpdkU1LAzEQhoMoKtWjVwl48bKaj81-XAQpVoWKPbTnkM3OdiPppia7Yv-9KWqp5jIZ5pmXmXkRuqDkhvOS3K6d3awooYzG7ACdMpLzJOUZOdz7n6DzEN5IfKnIMpofoxNOyoxyKk6RfjHau9oba023xK7B89a7YdkmT85CwKbDEwufprKAZ950PdR4bLweTB_wImx7Zka7ANp1NV7Y3qvQOt_j2WAD4KkK4M_QUaNidv4TR2gxeZiPn5Lp6-Pz-H6a6JSKPuFpCnWT50LXXHFdEBCi0LUoC1XlVcOqTCsAVopC6LRSlJRNrXROmWqAQ9nwEbr71l0P1QpqDV2cxsq1NyvlN9IpI_9WOtPKpfuQWUpoLngUuP4R8O59gNDLlQkarFUduCFIxkjGWFlwGtGrf-ibG3wX15NMFKzg8dJlpJJvKt44BA_NbhhK5NZB-cfByF_ub7Cjf_3iXwcamd0</recordid><startdate>20181214</startdate><enddate>20181214</enddate><creator>Zhao, Wanqin</creator><creator>Wang, Lingzhi</creator><general>MDPI AG</general><general>MDPI</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>7X8</scope><scope>5PM</scope></search><sort><creationdate>20181214</creationdate><title>Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser</title><author>Zhao, Wanqin ; Wang, Lingzhi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c415t-344edf775cd3a3c80e558cd598ab7bf2b6caee29585c4ba109fdac712afe3e9f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Ablation</topic><topic>Composite materials</topic><topic>Density</topic><topic>Dielectric properties</topic><topic>Drilling</topic><topic>Energy</topic><topic>Experiments</topic><topic>Lasers</topic><topic>Microdrilling</topic><topic>Morphology</topic><topic>Printed circuit boards</topic><topic>Printed circuits</topic><topic>Process parameters</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhao, Wanqin</creatorcontrib><creatorcontrib>Wang, Lingzhi</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><jtitle>Polymers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhao, Wanqin</au><au>Wang, Lingzhi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser</atitle><jtitle>Polymers</jtitle><addtitle>Polymers (Basel)</addtitle><date>2018-12-14</date><risdate>2018</risdate><volume>10</volume><issue>12</issue><spage>1390</spage><pages>1390-</pages><issn>2073-4360</issn><eissn>2073-4360</eissn><abstract>High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 µm and inlet interconnection pitches of 0~2 µm could be successfully drilled in FPCs using ultrashort pulse laser.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>30961315</pmid><doi>10.3390/polym10121390</doi><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 2073-4360 |
| ispartof | Polymers, 2018-12, Vol.10 (12), p.1390 |
| issn | 2073-4360 2073-4360 |
| language | eng |
| recordid | cdi_pubmedcentral_primary_oai_pubmedcentral_nih_gov_6401753 |
| source | PubMed Central Open Access; MDPI - Multidisciplinary Digital Publishing Institute; EZB-FREE-00999 freely available EZB journals; PubMed Central |
| subjects | Ablation Composite materials Density Dielectric properties Drilling Energy Experiments Lasers Microdrilling Morphology Printed circuit boards Printed circuits Process parameters |
| title | Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T13%3A51%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pubme&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Microdrilling%20of%20Through-Holes%20in%20Flexible%20Printed%20Circuits%20Using%20Picosecond%20Ultrashort%20Pulse%20Laser&rft.jtitle=Polymers&rft.au=Zhao,%20Wanqin&rft.date=2018-12-14&rft.volume=10&rft.issue=12&rft.spage=1390&rft.pages=1390-&rft.issn=2073-4360&rft.eissn=2073-4360&rft_id=info:doi/10.3390/polym10121390&rft_dat=%3Cproquest_pubme%3E2582836619%3C/proquest_pubme%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2582836619&rft_id=info:pmid/30961315&rfr_iscdi=true |