High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring
Aluminum alloys, which serve as heat sink in light-emitting diode (LED) lighting, are often inherent with a high thermal conductivity, but poor thermal total emissivity. Thus, high emissive coatings on the Al substrate can enhance the thermal dissipation efficiency of radiation. In this study, the u...
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| Veröffentlicht in: | Materials 2017-04, Vol.10 (5), p.454 |
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| creator | Tsai, Wei-Yu Huang, Guan-Rong Wang, Kuang-Kuo Chen, Chin-Fu Huang, J C |
| description | Aluminum alloys, which serve as heat sink in light-emitting diode (LED) lighting, are often inherent with a high thermal conductivity, but poor thermal total emissivity. Thus, high emissive coatings on the Al substrate can enhance the thermal dissipation efficiency of radiation. In this study, the ultrasonic mechanical coating and armoring (UMCA) technique was used to insert various ceramic combinations, such as Al₂O₃, SiO₂, or graphite, to enhance thermal dissipation. Analytic models have been established to couple the thermal radiation and convection on the sample surface through heat flow equations. A promising match has been reached between the theoretical predictions and experimental measurements. With the adequate insertion of ceramic powders, the temperature of the Al heat sinks can be lowered by 5-11 °C, which is highly favorable for applications requiring cooling components. |
| doi_str_mv | 10.3390/ma10050454 |
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Thus, high emissive coatings on the Al substrate can enhance the thermal dissipation efficiency of radiation. In this study, the ultrasonic mechanical coating and armoring (UMCA) technique was used to insert various ceramic combinations, such as Al₂O₃, SiO₂, or graphite, to enhance thermal dissipation. Analytic models have been established to couple the thermal radiation and convection on the sample surface through heat flow equations. A promising match has been reached between the theoretical predictions and experimental measurements. With the adequate insertion of ceramic powders, the temperature of the Al heat sinks can be lowered by 5-11 °C, which is highly favorable for applications requiring cooling components.</description><identifier>ISSN: 1996-1944</identifier><identifier>EISSN: 1996-1944</identifier><identifier>DOI: 10.3390/ma10050454</identifier><identifier>PMID: 28772814</identifier><language>eng</language><publisher>Switzerland: MDPI AG</publisher><subject>Aluminum ; Aluminum base alloys ; Aluminum oxide ; Atmospheric pressure ; Ceramic coatings ; Ceramic powders ; Ceramics ; Chemical vapor deposition ; Efficiency ; Experiments ; Flow equations ; Heat sinks ; Heat transfer ; Heat transmission ; Light emitting diodes ; Oxidation ; Protective coatings ; Radiation ; Silicon dioxide ; Substrates ; Thermal conductivity ; Thermal radiation</subject><ispartof>Materials, 2017-04, Vol.10 (5), p.454</ispartof><rights>Copyright MDPI AG 2017</rights><rights>2017 by the authors. 2017</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c406t-1c888bfd60d392140ba1b5523a0bb316e5e9c5f33b4c6053e4497a91eedeeef3</citedby><cites>FETCH-LOGICAL-c406t-1c888bfd60d392140ba1b5523a0bb316e5e9c5f33b4c6053e4497a91eedeeef3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC5458992/pdf/$$EPDF$$P50$$Gpubmedcentral$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC5458992/$$EHTML$$P50$$Gpubmedcentral$$Hfree_for_read</linktohtml><link.rule.ids>230,314,723,776,780,881,27901,27902,53766,53768</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/28772814$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Tsai, Wei-Yu</creatorcontrib><creatorcontrib>Huang, Guan-Rong</creatorcontrib><creatorcontrib>Wang, Kuang-Kuo</creatorcontrib><creatorcontrib>Chen, Chin-Fu</creatorcontrib><creatorcontrib>Huang, J C</creatorcontrib><title>High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring</title><title>Materials</title><addtitle>Materials (Basel)</addtitle><description>Aluminum alloys, which serve as heat sink in light-emitting diode (LED) lighting, are often inherent with a high thermal conductivity, but poor thermal total emissivity. 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With the adequate insertion of ceramic powders, the temperature of the Al heat sinks can be lowered by 5-11 °C, which is highly favorable for applications requiring cooling components.</description><subject>Aluminum</subject><subject>Aluminum base alloys</subject><subject>Aluminum oxide</subject><subject>Atmospheric pressure</subject><subject>Ceramic coatings</subject><subject>Ceramic powders</subject><subject>Ceramics</subject><subject>Chemical vapor deposition</subject><subject>Efficiency</subject><subject>Experiments</subject><subject>Flow equations</subject><subject>Heat sinks</subject><subject>Heat transfer</subject><subject>Heat transmission</subject><subject>Light emitting diodes</subject><subject>Oxidation</subject><subject>Protective coatings</subject><subject>Radiation</subject><subject>Silicon dioxide</subject><subject>Substrates</subject><subject>Thermal conductivity</subject><subject>Thermal radiation</subject><issn>1996-1944</issn><issn>1996-1944</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNpdkV1LHDEUhkNRqqg3_QEl0BspbM3nbHJTWLbWFSwK3dLLkMmc2YmdSdZkxuK_N9aP2ubmnJw85-UNL0LvKPnEuSYng6WESCKkeIP2qdbVjGohdl71e-go52tSDudUMf0W7TE1nzNFxT6aVn7T4XUHabA9_uJz9ls7-hhwbPGixyuwI_7uwy_8s4OAz0OGNPqwwUtIdvAOX8XfDaSM6zv8ox-TzTGU6TdwnS1N0VxG-2fBhgYv0hBTuRyi3db2GY6e6gFafz1dL1ezi8uz8-XiYuYEqcYZdUqpum0q0nDNqCC1pbWUjFtS15xWIEE72XJeC1cRyUEIPbeaAjQA0PID9PlRdjvVAzQOQjHYm23yg013Jlpv_n0JvjObeGukkEprVgSOnwRSvJkgj2bw2UHf2wBxyoZqVlWKVfIB_fAfeh2nFMrvCkWJ1HPJVKE-PlIuxZwTtC9mKDEPeZq_eRb4_Wv7L-hzevwewr6bsg</recordid><startdate>20170426</startdate><enddate>20170426</enddate><creator>Tsai, Wei-Yu</creator><creator>Huang, Guan-Rong</creator><creator>Wang, Kuang-Kuo</creator><creator>Chen, Chin-Fu</creator><creator>Huang, J C</creator><general>MDPI AG</general><general>MDPI</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PHGZM</scope><scope>PHGZT</scope><scope>PIMPY</scope><scope>PKEHL</scope><scope>PQEST</scope><scope>PQGLB</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>7X8</scope><scope>5PM</scope></search><sort><creationdate>20170426</creationdate><title>High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring</title><author>Tsai, Wei-Yu ; Huang, Guan-Rong ; Wang, Kuang-Kuo ; Chen, Chin-Fu ; Huang, J C</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c406t-1c888bfd60d392140ba1b5523a0bb316e5e9c5f33b4c6053e4497a91eedeeef3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Aluminum</topic><topic>Aluminum base alloys</topic><topic>Aluminum oxide</topic><topic>Atmospheric pressure</topic><topic>Ceramic coatings</topic><topic>Ceramic powders</topic><topic>Ceramics</topic><topic>Chemical vapor deposition</topic><topic>Efficiency</topic><topic>Experiments</topic><topic>Flow equations</topic><topic>Heat sinks</topic><topic>Heat transfer</topic><topic>Heat transmission</topic><topic>Light emitting diodes</topic><topic>Oxidation</topic><topic>Protective coatings</topic><topic>Radiation</topic><topic>Silicon dioxide</topic><topic>Substrates</topic><topic>Thermal conductivity</topic><topic>Thermal radiation</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Tsai, Wei-Yu</creatorcontrib><creatorcontrib>Huang, Guan-Rong</creatorcontrib><creatorcontrib>Wang, Kuang-Kuo</creatorcontrib><creatorcontrib>Chen, Chin-Fu</creatorcontrib><creatorcontrib>Huang, J C</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest Central (New)</collection><collection>ProQuest One Academic (New)</collection><collection>Publicly Available Content Database</collection><collection>ProQuest One Academic Middle East (New)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Applied & Life Sciences</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>MEDLINE - Academic</collection><collection>PubMed Central (Full Participant titles)</collection><jtitle>Materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Tsai, Wei-Yu</au><au>Huang, Guan-Rong</au><au>Wang, Kuang-Kuo</au><au>Chen, Chin-Fu</au><au>Huang, J C</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring</atitle><jtitle>Materials</jtitle><addtitle>Materials (Basel)</addtitle><date>2017-04-26</date><risdate>2017</risdate><volume>10</volume><issue>5</issue><spage>454</spage><pages>454-</pages><issn>1996-1944</issn><eissn>1996-1944</eissn><abstract>Aluminum alloys, which serve as heat sink in light-emitting diode (LED) lighting, are often inherent with a high thermal conductivity, but poor thermal total emissivity. Thus, high emissive coatings on the Al substrate can enhance the thermal dissipation efficiency of radiation. In this study, the ultrasonic mechanical coating and armoring (UMCA) technique was used to insert various ceramic combinations, such as Al₂O₃, SiO₂, or graphite, to enhance thermal dissipation. Analytic models have been established to couple the thermal radiation and convection on the sample surface through heat flow equations. A promising match has been reached between the theoretical predictions and experimental measurements. With the adequate insertion of ceramic powders, the temperature of the Al heat sinks can be lowered by 5-11 °C, which is highly favorable for applications requiring cooling components.</abstract><cop>Switzerland</cop><pub>MDPI AG</pub><pmid>28772814</pmid><doi>10.3390/ma10050454</doi><oa>free_for_read</oa></addata></record> |
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| source | MDPI - Multidisciplinary Digital Publishing Institute; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; PubMed Central; Free Full-Text Journals in Chemistry; PubMed Central Open Access |
| subjects | Aluminum Aluminum base alloys Aluminum oxide Atmospheric pressure Ceramic coatings Ceramic powders Ceramics Chemical vapor deposition Efficiency Experiments Flow equations Heat sinks Heat transfer Heat transmission Light emitting diodes Oxidation Protective coatings Radiation Silicon dioxide Substrates Thermal conductivity Thermal radiation |
| title | High Thermal Dissipation of Al Heat Sink When Inserting Ceramic Powders by Ultrasonic Mechanical Coating and Armoring |
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