Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound
The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We...
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Veröffentlicht in: | Scientific reports 2016-08, Vol.6 (1), p.30907-30907, Article 30907 |
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creator | Han, Seung Zeon Lim, Sung Hwan Kim, Sangshik Lee, Jehyun Goto, Masahiro Kim, Hyung Giun Han, Byungchan Kim, Kwang Ho |
description | The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys. |
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We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.</description><identifier>ISSN: 2045-2322</identifier><identifier>EISSN: 2045-2322</identifier><identifier>DOI: 10.1038/srep30907</identifier><identifier>PMID: 27488621</identifier><language>eng</language><publisher>London: Nature Publishing Group UK</publisher><subject>639/301/1023/1025 ; 639/301/1023/1026 ; 639/301/1023/303 ; 639/301/357/354 ; Alloys ; Ductility ; Electrical conductivity ; Heat treatment ; Humanities and Social Sciences ; Intermetallic compounds ; multidisciplinary ; Plastics ; Science ; Temperature effects ; Tensile strength</subject><ispartof>Scientific reports, 2016-08, Vol.6 (1), p.30907-30907, Article 30907</ispartof><rights>The Author(s) 2016</rights><rights>Copyright Nature Publishing Group Aug 2016</rights><rights>Copyright © 2016, The Author(s) 2016 The Author(s)</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c574t-d170f6edbdd81f74f0ca2629c621dfe0bd028e075c1430eee2feaf94f6c7c3453</citedby><cites>FETCH-LOGICAL-c574t-d170f6edbdd81f74f0ca2629c621dfe0bd028e075c1430eee2feaf94f6c7c3453</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC4973219/pdf/$$EPDF$$P50$$Gpubmedcentral$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC4973219/$$EHTML$$P50$$Gpubmedcentral$$Hfree_for_read</linktohtml><link.rule.ids>230,314,723,776,780,860,881,27901,27902,41096,42165,51551,53766,53768</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/27488621$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Han, Seung Zeon</creatorcontrib><creatorcontrib>Lim, Sung Hwan</creatorcontrib><creatorcontrib>Kim, Sangshik</creatorcontrib><creatorcontrib>Lee, Jehyun</creatorcontrib><creatorcontrib>Goto, Masahiro</creatorcontrib><creatorcontrib>Kim, Hyung Giun</creatorcontrib><creatorcontrib>Han, Byungchan</creatorcontrib><creatorcontrib>Kim, Kwang Ho</creatorcontrib><title>Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound</title><title>Scientific reports</title><addtitle>Sci Rep</addtitle><addtitle>Sci Rep</addtitle><description>The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.</description><subject>639/301/1023/1025</subject><subject>639/301/1023/1026</subject><subject>639/301/1023/303</subject><subject>639/301/357/354</subject><subject>Alloys</subject><subject>Ductility</subject><subject>Electrical conductivity</subject><subject>Heat treatment</subject><subject>Humanities and Social Sciences</subject><subject>Intermetallic compounds</subject><subject>multidisciplinary</subject><subject>Plastics</subject><subject>Science</subject><subject>Temperature effects</subject><subject>Tensile strength</subject><issn>2045-2322</issn><issn>2045-2322</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>C6C</sourceid><sourceid>BENPR</sourceid><recordid>eNplkcFrHCEYxaW0NCHNof9AEXppCtuq44zjpVCWpA0EcknP4urnrGFGp-oE9r-vyybLtvWi-H7f88lD6D0lXyhp-q85wdwQScQrdM4Ib1esYez1yfkMXeb8SOpqmeRUvkVnTPC-7xg9R-k2mAQ6-zDgXBKEoWyxDhabGOxiin_yZYejw-sF63GMO1y2KS5DhTYhpkmPeB51Lt5gC25_UXwM-wEdsA8F0gSlDlbdxGmOS7Dv0BunxwyXz_sF-nVz_bD-ubq7_3G7_n63Mq3gZWWpIK4Du7G2p05wR4xmHZOm5rYOyMYS1gMRraG8IQDAHGgnueuMMA1vmwv07eA7L5sJrIFQkh7VnPyk005F7dXfSvBbNcQnxaVoGJXV4NOzQYq_F8hFTT4bGEcdIC5Z0Z7IjtC2IxX9-A_6GJcU6vcUlYQK3vK-q9TVgTIp5tqbO4ahRO3LVMcyK_vhNP2RfKmuAp8PQK5SGCCdPPmf2x8j56xI</recordid><startdate>20160804</startdate><enddate>20160804</enddate><creator>Han, Seung Zeon</creator><creator>Lim, Sung Hwan</creator><creator>Kim, Sangshik</creator><creator>Lee, Jehyun</creator><creator>Goto, Masahiro</creator><creator>Kim, Hyung Giun</creator><creator>Han, Byungchan</creator><creator>Kim, Kwang Ho</creator><general>Nature Publishing Group UK</general><general>Nature Publishing Group</general><scope>C6C</scope><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7X7</scope><scope>7XB</scope><scope>88A</scope><scope>88E</scope><scope>88I</scope><scope>8FE</scope><scope>8FH</scope><scope>8FI</scope><scope>8FJ</scope><scope>8FK</scope><scope>ABUWG</scope><scope>AEUYN</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BBNVY</scope><scope>BENPR</scope><scope>BHPHI</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FYUFA</scope><scope>GHDGH</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>K9.</scope><scope>LK8</scope><scope>M0S</scope><scope>M1P</scope><scope>M2P</scope><scope>M7P</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>7X8</scope><scope>5PM</scope></search><sort><creationdate>20160804</creationdate><title>Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound</title><author>Han, Seung Zeon ; 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We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.</abstract><cop>London</cop><pub>Nature Publishing Group UK</pub><pmid>27488621</pmid><doi>10.1038/srep30907</doi><tpages>1</tpages><oa>free_for_read</oa></addata></record> |
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subjects | 639/301/1023/1025 639/301/1023/1026 639/301/1023/303 639/301/357/354 Alloys Ductility Electrical conductivity Heat treatment Humanities and Social Sciences Intermetallic compounds multidisciplinary Plastics Science Temperature effects Tensile strength |
title | Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound |
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