Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

The downsizing of solder balls results in larger interfacial intermetallic compound (IMC) grains and less Cu substrate consumption in lead-free soldering on Cu substrates. This size effect on the interfacial reaction is experimentally demonstrated and theoretically analyzed using Sn-3.0Ag-0.5Cu and...

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Veröffentlicht in:	Scientific reports 2014-11, Vol.4 (1), p.7117-7117, Article 7117
Hauptverfasser:	Huang, M. L., Yang, F.
Format:	Artikel
Sprache:	eng
Schlagworte:	147/135 639/301/1005/1007 639/301/1034/1037 639/301/119/2795 639/301/119/544 Dissolution Growth kinetics Humanities and Social Sciences Intermetallic compounds multidisciplinary Science Soldering Substrates
Online-Zugang:	Volltext
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