Organosilicon Compounds in Hot-Melt Adhesive Technologies
Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecu...
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| Veröffentlicht in: | Polymers 2023-09, Vol.15 (18), p.3708 |
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| creator | Czakaj, Jakub Sztorch, Bogna Romanczuk-Ruszuk, Eliza Brząkalski, Dariusz Przekop, Robert E. |
| description | Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol–gel condensation products or their mechanism of action on the adherent surface can be considered of sol–gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018–2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives. |
| doi_str_mv | 10.3390/polym15183708 |
| format | Article |
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Organosilicon compounds are hybrid molecules that have both inorganic and organic components and can enhance the properties and performance of HMAs. The gel aspect of HMA with and without organosilicon modifiers can be considered in organosilicon-modified systems, the modifiers are often either sol–gel condensation products or their mechanism of action on the adherent surface can be considered of sol–gel type. The purpose of this manuscript is to present the current state of the art on the formulation, characterization, and application of HMAs and optimize their performance with organosilicon compounds for application in various industries such as automotive, construction, and photovoltaics. This review covers articles published within the period of 2018–2022. The article is divided into sections, in which information about hot-melt adhesives is described at the beginning. The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. The last part of this review outlines the future trends in hot-melt adhesives.</description><identifier>ISSN: 2073-4360</identifier><identifier>EISSN: 2073-4360</identifier><identifier>DOI: 10.3390/polym15183708</identifier><identifier>PMID: 37765562</identifier><language>eng</language><publisher>Basel: MDPI AG</publisher><subject>Adhesion ; Adhesives ; Bond strength ; Book publishing ; Condensates ; Cooling ; Crosslinked polymers ; Crosslinking ; Electronics industry ; Energy ; Gels ; Heat ; Hydrocarbons ; Organosilicon compounds ; Photovoltaic cells ; Polymers ; Resins ; Review ; Shrink wrapping ; Silicon compounds ; Sol-gel processes ; Substrates ; Thermoplastics ; Viscoelasticity ; Viscosity</subject><ispartof>Polymers, 2023-09, Vol.15 (18), p.3708</ispartof><rights>COPYRIGHT 2023 MDPI AG</rights><rights>2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). 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The following part of the presented review focuses on the composition of hot-melt adhesives, which takes into account the use of organosilicon compounds. 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| source | PubMed Central Open Access; MDPI - Multidisciplinary Digital Publishing Institute; EZB-FREE-00999 freely available EZB journals; PubMed Central |
| subjects | Adhesion Adhesives Bond strength Book publishing Condensates Cooling Crosslinked polymers Crosslinking Electronics industry Energy Gels Heat Hydrocarbons Organosilicon compounds Photovoltaic cells Polymers Resins Review Shrink wrapping Silicon compounds Sol-gel processes Substrates Thermoplastics Viscoelasticity Viscosity |
| title | Organosilicon Compounds in Hot-Melt Adhesive Technologies |
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