High‐Rate Printing of Micro/Nanoscale Patterns Using Interfacial Convective Assembly

Printing of electronics has been receiving increasing attention from academia and industry over the recent years. However, commonly used printing techniques have limited resolution of micro‐ or sub‐microscale. Here, a directed‐assembly‐based printing technique, interfacial convective assembly, is reported, which utilizes a substrate‐heating‐induced solutal Marangoni convective flow to drive particles toward patterned substrates and then uses van der Waals interactions as well as geometrical confinement to trap the particles in the pattern areas. The influence of various assembly parameters including type of mixing solvent, substrate temperature, particle concentration, and assembly time is investigated. The results show successful assembly of various nanoparticles in patterns of different shapes with a high resolution down to 25 nm. In addition, the assembly only takes a few minutes, which is two orders of magnitude faster than conventional convective assembly. Small‐sized (diameter below 5 nm) nanoparticles tend to coalesce during the assembly process and form sintered structures. The fabricated silver nanorods show single‐crystal structure with a low resistivity of 8.58 × 10−5 Ω cm. With high versatility, high resolution, and high throughput, the interfacial convective assembly opens remarkable opportunities for printing next generation nanoelectronics and sensors. A directed‐assembly‐based printing technique, interfacial convective assembly, is developed to print micro/nanoscale patterns at desired areas of substrates. Various nanoparticles are printed in patterns of different shapes with a high resolution down to 25 nm. Assembly only takes a few minutes, which is two orders of magnitude faster than the conventional convective assembly.