The application of the scallop nanostructure in deep silicon etching

Micro/nanostructures with high aspect ratios in silicon wafers obtained by plasma etching are of great significance in device fabrication. In most cases, the scallop nanostructure in deep silicon etching should be suppressed. However, the scallop nanostructure could be applied in electronic device f...

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Veröffentlicht in:	Nanotechnology 2020-07, Vol.31 (31), p.315301
Hauptverfasser:	Lin, Yuanwei, Yuan, Renzhi, Zhou, Ce, Dong, Zihan, Su, Ziduo, Zhang, Haimiao, Chen, Zhenpeng, Li, Yunyun, Wang, Chun
Format:	Artikel
Sprache:	eng
Schlagworte:	Bosch process deep silicon etching fluorocarbon polymer minimum effect scallop nanostructure
Online-Zugang:	Volltext
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