Oblique angled plasma etching for 3D silicon structures with wiggling geometries

Three dimensional (3D) silicon micro- and nanostructures have attracted special research interest, particularly in photonic and electrochemical devices, due to the extra degrees of freedom for manipulation of device performance and properties. However, it is still considered to be difficult to fabri...

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Veröffentlicht in:	Nanotechnology 2020-02, Vol.31 (8), p.085301
1. Verfasser:	Chang, Bingdong
Format:	Artikel
Sprache:	eng
Schlagworte:	3D fabrication DREM DRIE oblique-angled plasma etching silicon
Online-Zugang:	Volltext
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