Use Thermal Analysis And Other Types Of Simulation To Craft A "Cool" Design
This may conflict with the thermal management ideal. Placing components close together results in increased power density locally and leads to elevated temperatures among all the components in a group. When components are grouped tightly to improve electrical performance, the "thermal victim&qu...
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Veröffentlicht in: | Electronic Design 2011-10, Vol.59 (13), p.60 |
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Hauptverfasser: | , |
Format: | Magazinearticle |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | This may conflict with the thermal management ideal. Placing components close together results in increased power density locally and leads to elevated temperatures among all the components in a group. When components are grouped tightly to improve electrical performance, the "thermal victim" effect may appear in components that would not otherwise pose a thermal challenge. |
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ISSN: | 0013-4872 1944-9550 |