Use Thermal Analysis And Other Types Of Simulation To Craft A "Cool" Design

This may conflict with the thermal management ideal. Placing components close together results in increased power density locally and leads to elevated temperatures among all the components in a group. When components are grouped tightly to improve electrical performance, the "thermal victim&qu...

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Veröffentlicht in:Electronic Design 2011-10, Vol.59 (13), p.60
Hauptverfasser: Blackmore, Byron, Carrier, Patrick
Format: Magazinearticle
Sprache:eng
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Zusammenfassung:This may conflict with the thermal management ideal. Placing components close together results in increased power density locally and leads to elevated temperatures among all the components in a group. When components are grouped tightly to improve electrical performance, the "thermal victim" effect may appear in components that would not otherwise pose a thermal challenge.
ISSN:0013-4872
1944-9550