Adsorption mechanism of E‐glass fiber/Aluminum particles/MWCNT filled epoxy matrix polymer composite in electronic applications

The main objective of the research is developed toward adsorption electronic devices (Interface material) with the performance examined by the physical, mechanical, and thermal properties of the E‐glass fiber reinforced with the epoxy composite and particulate dispersed into the matrix in partial fulfillment of tiny amount of aluminum powder particles and MWCNT. Composite membranes with 15 wt.% E‐glass fiber and 2 wt.%, 4 wt.%, and 6 wt.% fine aluminum powder particle concentrations were partially filled with 0 wt.%, 0.5 wt.%, and 1.0 wt.% MWCNTs. Vacuum lay‐up technique is used to create the better adhesive hybrid composite, which is then assessed of the characteristics of the materials. The maximum thermal conductivity of EAEM2 (E‐Epoxy, A‐Aluminum particle, E‐E‐glass fiber, M‐MWCNT) is 0.3057 W/mK. The tensile, bending, and impact strengths of EAEM1 composites are higher than those of EAEM2 and EAEM3 (average values of EAEM1 composites: 86 MPa, 123.33 MPa, and 90.66 J/m2). However, the Shore‐D hardness of EAEM3 is 95.33. The test findings demonstrate a significant improvement in thermal properties with minimal marginal decrements in mechanical capabilities when carbon allotropes are increased. The composite system's morphology (EAEM3) demonstrates a clustered distribution of aluminum powder particles in the matrix.