Move Your Thermal Strategy For Air-Cooled Electronics Up In The Design Flow

Move Your Thermal Strategy For Air-Cooled Electronics Up In The Design Flow

The block models described earlier are crude, providing "indicative" case temperatures. In conjunction with package selection, the component thermal model should be updated to at least a tworesistor compact thermal model.2 This will capture the package's thermal behavior as two resist...

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Veröffentlicht in:Electronic Design 2009-07, Vol.57 (14), p.39-42
Hauptverfasser: Parry, John, Bornoff, Robin, Blackmore, Byron
Format: Magazinearticle
Sprache:eng
Schlagworte:
Architecture
Cooling
Design
Design engineering
Designers
Electronics
Engineers
Fluid dynamics
Heat conductivity
Prototypes
Simulation
Temperature
Thermal cycling
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Beschreibung
Zusammenfassung:The block models described earlier are crude, providing "indicative" case temperatures. In conjunction with package selection, the component thermal model should be updated to at least a tworesistor compact thermal model.2 This will capture the package's thermal behavior as two resistances: junction-to-case and junction-to-board, or preferably a Delphi compact thermal model.3
ISSN:0013-4872
1944-9550