Signal integrity approaches meet multigigabit/s design challenge

For the SI analysis flow in flux at multigigabit/s rates, the UDM is a potential solution. Rather than make the engineer wait until very late in the How ID have access to complet eel layouts for post-layout SI analysis, the UDM provides early incremental access of electromagnetic (EM) simulation res...

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Veröffentlicht in:Electronic Engineering Times 2007-03 (1468), p.S4
Hauptverfasser: Heimlich, Mike, Wedge, Scott
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container_title Electronic Engineering Times
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creator Heimlich, Mike
Wedge, Scott
description For the SI analysis flow in flux at multigigabit/s rates, the UDM is a potential solution. Rather than make the engineer wait until very late in the How ID have access to complet eel layouts for post-layout SI analysis, the UDM provides early incremental access of electromagnetic (EM) simulation results to the SI engineer prior to, or as part of, formal pc board layout.
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fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_reports_208085346</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1249267131</sourcerecordid><originalsourceid>FETCH-proquest_reports_2080853463</originalsourceid><addsrcrecordid>eNqNjDkOwjAQAF2ARDj-YB4QYedS6JAQiB76aAmLY-Q4xrsp-D0peADVNDMzE4nS-yzVZaEXYkn0UkqrvNKJOFyt8eCk9YwmWv5ICCEO0HZIskdk2Y-OrbEG7pZ3JB9IUyHbDpxDb3At5k9whJsfV2J7Pt2Ol3S6vEckbiKGITI1mapVXeZFlf_jfAEsGDfU</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>208085346</pqid></control><display><type>article</type><title>Signal integrity approaches meet multigigabit/s design challenge</title><source>Alma/SFX Local Collection</source><creator>Heimlich, Mike ; Wedge, Scott</creator><creatorcontrib>Heimlich, Mike ; Wedge, Scott</creatorcontrib><description>For the SI analysis flow in flux at multigigabit/s rates, the UDM is a potential solution. Rather than make the engineer wait until very late in the How ID have access to complet eel layouts for post-layout SI analysis, the UDM provides early incremental access of electromagnetic (EM) simulation results to the SI engineer prior to, or as part of, formal pc board layout.</description><identifier>ISSN: 0192-1541</identifier><identifier>CODEN: EETIDQ</identifier><language>eng</language><publisher>Cambridge: AspenCore</publisher><subject>Co-design ; Communications systems ; Critical path ; Data integrity ; Data models ; Electronic design automation ; Frequency distribution ; Integrated circuits ; Packaging ; Product development ; Simulation ; Software ; Transistors</subject><ispartof>Electronic Engineering Times, 2007-03 (1468), p.S4</ispartof><rights>Copyright CMP Media LLC Mar 26, 2007</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>312,776,780,787</link.rule.ids></links><search><creatorcontrib>Heimlich, Mike</creatorcontrib><creatorcontrib>Wedge, Scott</creatorcontrib><title>Signal integrity approaches meet multigigabit/s design challenge</title><title>Electronic Engineering Times</title><description>For the SI analysis flow in flux at multigigabit/s rates, the UDM is a potential solution. Rather than make the engineer wait until very late in the How ID have access to complet eel layouts for post-layout SI analysis, the UDM provides early incremental access of electromagnetic (EM) simulation results to the SI engineer prior to, or as part of, formal pc board layout.</description><subject>Co-design</subject><subject>Communications systems</subject><subject>Critical path</subject><subject>Data integrity</subject><subject>Data models</subject><subject>Electronic design automation</subject><subject>Frequency distribution</subject><subject>Integrated circuits</subject><subject>Packaging</subject><subject>Product development</subject><subject>Simulation</subject><subject>Software</subject><subject>Transistors</subject><issn>0192-1541</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><sourceid>BEC</sourceid><sourceid>BENPR</sourceid><recordid>eNqNjDkOwjAQAF2ARDj-YB4QYedS6JAQiB76aAmLY-Q4xrsp-D0peADVNDMzE4nS-yzVZaEXYkn0UkqrvNKJOFyt8eCk9YwmWv5ICCEO0HZIskdk2Y-OrbEG7pZ3JB9IUyHbDpxDb3At5k9whJsfV2J7Pt2Ol3S6vEckbiKGITI1mapVXeZFlf_jfAEsGDfU</recordid><startdate>20070326</startdate><enddate>20070326</enddate><creator>Heimlich, Mike</creator><creator>Wedge, Scott</creator><general>AspenCore</general><scope>0TR</scope><scope>0TS</scope><scope>0U~</scope><scope>1-H</scope><scope>3V.</scope><scope>7RQ</scope><scope>7WY</scope><scope>7XB</scope><scope>88K</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JQ2</scope><scope>K6~</scope><scope>K7-</scope><scope>KK.</scope><scope>L.-</scope><scope>L.0</scope><scope>M0F</scope><scope>M0N</scope><scope>M1Q</scope><scope>M2T</scope><scope>P5Z</scope><scope>P62</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>Q9U</scope></search><sort><creationdate>20070326</creationdate><title>Signal integrity approaches meet multigigabit/s design challenge</title><author>Heimlich, Mike ; Wedge, Scott</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-proquest_reports_2080853463</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>Co-design</topic><topic>Communications systems</topic><topic>Critical path</topic><topic>Data integrity</topic><topic>Data models</topic><topic>Electronic design automation</topic><topic>Frequency distribution</topic><topic>Integrated circuits</topic><topic>Packaging</topic><topic>Product development</topic><topic>Simulation</topic><topic>Software</topic><topic>Transistors</topic><toplevel>online_resources</toplevel><creatorcontrib>Heimlich, Mike</creatorcontrib><creatorcontrib>Wedge, Scott</creatorcontrib><collection>Engineering Basic PRO</collection><collection>Engineering Premium PRO</collection><collection>Global News &amp; ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>ProQuest Central (Corporate)</collection><collection>Career &amp; Technical Education Database</collection><collection>ABI/INFORM Collection</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Telecommunications (Alumni Edition)</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>eLibrary</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Computer Science Collection</collection><collection>ProQuest Business Collection</collection><collection>Computer Science Database</collection><collection>UBM Computer Full Text</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Professional Standard</collection><collection>ABI/INFORM Trade &amp; Industry</collection><collection>Computing Database</collection><collection>Military Database</collection><collection>Telecommunications Database</collection><collection>Advanced Technologies &amp; Aerospace Database</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>One Business (ProQuest)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>ProQuest Central Basic</collection><jtitle>Electronic Engineering Times</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Heimlich, Mike</au><au>Wedge, Scott</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Signal integrity approaches meet multigigabit/s design challenge</atitle><jtitle>Electronic Engineering Times</jtitle><date>2007-03-26</date><risdate>2007</risdate><issue>1468</issue><spage>S4</spage><pages>S4-</pages><issn>0192-1541</issn><coden>EETIDQ</coden><abstract>For the SI analysis flow in flux at multigigabit/s rates, the UDM is a potential solution. Rather than make the engineer wait until very late in the How ID have access to complet eel layouts for post-layout SI analysis, the UDM provides early incremental access of electromagnetic (EM) simulation results to the SI engineer prior to, or as part of, formal pc board layout.</abstract><cop>Cambridge</cop><pub>AspenCore</pub></addata></record>
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ispartof Electronic Engineering Times, 2007-03 (1468), p.S4
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language eng
recordid cdi_proquest_reports_208085346
source Alma/SFX Local Collection
subjects Co-design
Communications systems
Critical path
Data integrity
Data models
Electronic design automation
Frequency distribution
Integrated circuits
Packaging
Product development
Simulation
Software
Transistors
title Signal integrity approaches meet multigigabit/s design challenge
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T01%3A01%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Signal%20integrity%20approaches%20meet%20multigigabit/s%20design%20challenge&rft.jtitle=Electronic%20Engineering%20Times&rft.au=Heimlich,%20Mike&rft.date=2007-03-26&rft.issue=1468&rft.spage=S4&rft.pages=S4-&rft.issn=0192-1541&rft.coden=EETIDQ&rft_id=info:doi/&rft_dat=%3Cproquest%3E1249267131%3C/proquest%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=208085346&rft_id=info:pmid/&rfr_iscdi=true