Fracture behavior of Cu-cored solder joints
Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder j...
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| Veröffentlicht in: | Journal of materials science 2011-11, Vol.46 (21), p.6897-6903 |
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| container_end_page | 6903 |
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| container_issue | 21 |
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| container_title | Journal of materials science |
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| creator | Kim, Yunsung Choi, Hyelim Lee, Hyoungjoo Shin, Dongjun Moon, Jeongtak Choe, Heeman |
| description | Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer. |
| doi_str_mv | 10.1007/s10853-011-5654-x |
| format | Article |
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Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.</description><identifier>ISSN: 0022-2461</identifier><identifier>EISSN: 1573-4803</identifier><identifier>DOI: 10.1007/s10853-011-5654-x</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Classical Mechanics ; Copper ; Crystallography and Scattering Methods ; Failure modes ; Fracture mechanics ; Fracture strength ; Materials Science ; Microelectronics ; Plating ; Polymer Sciences ; Semiconductors ; Shear tests ; Soldered joints ; Solders ; Solid Mechanics ; Tin ; Tin base alloys ; Transportation applications ; Transportation systems ; Wettability</subject><ispartof>Journal of materials science, 2011-11, Vol.46 (21), p.6897-6903</ispartof><rights>Springer Science+Business Media, LLC 2011</rights><rights>COPYRIGHT 2011 Springer</rights><rights>Journal of Materials Science is a copyright of Springer, (2011). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c494t-ac9b2db97747096df88c924eef67a67becdb1f3a26ef14921bee3b0ad7232f203</citedby><cites>FETCH-LOGICAL-c494t-ac9b2db97747096df88c924eef67a67becdb1f3a26ef14921bee3b0ad7232f203</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10853-011-5654-x$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10853-011-5654-x$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Kim, Yunsung</creatorcontrib><creatorcontrib>Choi, Hyelim</creatorcontrib><creatorcontrib>Lee, Hyoungjoo</creatorcontrib><creatorcontrib>Shin, Dongjun</creatorcontrib><creatorcontrib>Moon, Jeongtak</creatorcontrib><creatorcontrib>Choe, Heeman</creatorcontrib><title>Fracture behavior of Cu-cored solder joints</title><title>Journal of materials science</title><addtitle>J Mater Sci</addtitle><description>Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Classical Mechanics</subject><subject>Copper</subject><subject>Crystallography and Scattering Methods</subject><subject>Failure modes</subject><subject>Fracture mechanics</subject><subject>Fracture strength</subject><subject>Materials Science</subject><subject>Microelectronics</subject><subject>Plating</subject><subject>Polymer Sciences</subject><subject>Semiconductors</subject><subject>Shear tests</subject><subject>Soldered joints</subject><subject>Solders</subject><subject>Solid Mechanics</subject><subject>Tin</subject><subject>Tin base alloys</subject><subject>Transportation applications</subject><subject>Transportation systems</subject><subject>Wettability</subject><issn>0022-2461</issn><issn>1573-4803</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNqNkV1rFDEUhoNYcG39Ad4NeCEiqcnJ1-SyLFYLBcHW65DJnKyzzE5qMlPWf2_KCFpBlFwcCM_zcpKXkJecnXPGzLvCWasEZZxTpZWkxydkw5URVLZMPCUbxgAoSM2fkeel7BljygDfkLeX2Yd5ydh0-NXfDyk3KTbbhYaUsW9KGnvMzT4N01zOyEn0Y8EXP-cp-XL5_nb7kV5_-nC1vbimQVo5Ux9sB31njZGGWd3Htg0WJGLUxmvTYeg7HoUHjZFLC7xDFB3zvQEBEZg4Ja_X3Lucvi1YZncYSsBx9BOmpTgLWoDQmlfy1R_kPi15qss5AGWNEKq1lTpfqZ0f0Q1TTHN9dD09HoaQJoxDvb9Qum1bC0L-ryA5SM6FVFV480iozIzHeeeXUtzVzefH4f9if8_lKxtyKiVjdHd5OPj83XHmHnp3a--u9u4eenfH6sDqlMpOO8y__uTv0g-rnaxs</recordid><startdate>20111101</startdate><enddate>20111101</enddate><creator>Kim, Yunsung</creator><creator>Choi, Hyelim</creator><creator>Lee, Hyoungjoo</creator><creator>Shin, Dongjun</creator><creator>Moon, Jeongtak</creator><creator>Choe, Heeman</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>ISR</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20111101</creationdate><title>Fracture behavior of Cu-cored solder joints</title><author>Kim, Yunsung ; 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Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10853-011-5654-x</doi><tpages>7</tpages></addata></record> |
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| subjects | Characterization and Evaluation of Materials Chemistry and Materials Science Classical Mechanics Copper Crystallography and Scattering Methods Failure modes Fracture mechanics Fracture strength Materials Science Microelectronics Plating Polymer Sciences Semiconductors Shear tests Soldered joints Solders Solid Mechanics Tin Tin base alloys Transportation applications Transportation systems Wettability |
| title | Fracture behavior of Cu-cored solder joints |
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