Unexpected Thermal Fracture of a Ceramic Sensor
A ceramic substrate bonded to an electronic sensor was reported to crack during thermal testing between −46 and +71 °C. Initially, this was assumed to occur at high temperature because of the thermal expansion of a polymer pad under the sensor. However, further investigations indicated that fracture...
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| Veröffentlicht in: | Journal of failure analysis and prevention 2011-10, Vol.11 (5), p.478-480, Article 478 |
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| container_title | Journal of failure analysis and prevention |
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| creator | Blanco, Letia Taylor, Stuart Wiggins, Kirk |
| description | A ceramic substrate bonded to an electronic sensor was reported to crack during thermal testing between −46 and +71 °C. Initially, this was assumed to occur at high temperature because of the thermal expansion of a polymer pad under the sensor. However, further investigations indicated that fracture was also occurring at low temperature. This was surprising since the suspected cause of fracture was pressure exerted by the polymer pad under the ceramic. This polymer pad has a coefficient of thermal expansion much greater than any other component. Conventional wisdom suggests that this failure would happen only during expansion of the pad during high temperature phases of temperature cycling. Subsequent dynamic thermal analysis revealed that differential contraction of the steel clamp fasteners was causing pressure to be exerted on the ceramic during the initial phase of the cold cycle. In addition, lateral constraint of the polymer pad caused pressure to rise to counterintuitive levels. An alteration of the geometry of the pad proved to be the simplest and most economical solution. This was confirmed by subsequent testing. |
| doi_str_mv | 10.1007/s11668-011-9483-7 |
| format | Article |
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Initially, this was assumed to occur at high temperature because of the thermal expansion of a polymer pad under the sensor. However, further investigations indicated that fracture was also occurring at low temperature. This was surprising since the suspected cause of fracture was pressure exerted by the polymer pad under the ceramic. This polymer pad has a coefficient of thermal expansion much greater than any other component. Conventional wisdom suggests that this failure would happen only during expansion of the pad during high temperature phases of temperature cycling. Subsequent dynamic thermal analysis revealed that differential contraction of the steel clamp fasteners was causing pressure to be exerted on the ceramic during the initial phase of the cold cycle. In addition, lateral constraint of the polymer pad caused pressure to rise to counterintuitive levels. An alteration of the geometry of the pad proved to be the simplest and most economical solution. This was confirmed by subsequent testing.</description><identifier>ISSN: 1547-7029</identifier><identifier>EISSN: 1728-5674</identifier><identifier>EISSN: 1864-1245</identifier><identifier>DOI: 10.1007/s11668-011-9483-7</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Applied sciences ; Building materials. Ceramics. 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Anal. and Preven</addtitle><description>A ceramic substrate bonded to an electronic sensor was reported to crack during thermal testing between −46 and +71 °C. Initially, this was assumed to occur at high temperature because of the thermal expansion of a polymer pad under the sensor. However, further investigations indicated that fracture was also occurring at low temperature. This was surprising since the suspected cause of fracture was pressure exerted by the polymer pad under the ceramic. This polymer pad has a coefficient of thermal expansion much greater than any other component. Conventional wisdom suggests that this failure would happen only during expansion of the pad during high temperature phases of temperature cycling. Subsequent dynamic thermal analysis revealed that differential contraction of the steel clamp fasteners was causing pressure to be exerted on the ceramic during the initial phase of the cold cycle. 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Glasses</topic><topic>Case History---Peer-Reviewed</topic><topic>Ceramic industries</topic><topic>Ceramics</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical industry and chemicals</topic><topic>Chemistry and Materials Science</topic><topic>Classical Mechanics</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Corrosion and Coatings</topic><topic>Economics</topic><topic>Electronics</topic><topic>Electrotechnical and electronic ceramics</topic><topic>Exact sciences and technology</topic><topic>Failure</topic><topic>Fatigue, brittleness, fracture, and cracks</topic><topic>Fracture mechanics</topic><topic>Fracture mechanics (crack, fatigue, damage...)</topic><topic>Fundamental areas of phenomenology (including applications)</topic><topic>General equipment and techniques</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Materials Science</topic><topic>Mechanical and acoustical properties of condensed matter</topic><topic>Mechanical properties of solids</topic><topic>Phases</topic><topic>Physics</topic><topic>Quality Control</topic><topic>Reliability</topic><topic>Safety and Risk</topic><topic>Sensors</topic><topic>Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing</topic><topic>Solid Mechanics</topic><topic>Structural and continuum mechanics</topic><topic>Technical ceramics</topic><topic>Thermal expansion</topic><topic>Tribology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Blanco, Letia</creatorcontrib><creatorcontrib>Taylor, Stuart</creatorcontrib><creatorcontrib>Wiggins, Kirk</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Materials Business File</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>Ceramic Abstracts</collection><jtitle>Journal of failure analysis and prevention</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Blanco, Letia</au><au>Taylor, Stuart</au><au>Wiggins, Kirk</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Unexpected Thermal Fracture of a Ceramic Sensor</atitle><jtitle>Journal of failure analysis and prevention</jtitle><stitle>J Fail. Anal. and Preven</stitle><date>2011-10-01</date><risdate>2011</risdate><volume>11</volume><issue>5</issue><spage>478</spage><epage>480</epage><pages>478-480</pages><artnum>478</artnum><issn>1547-7029</issn><eissn>1728-5674</eissn><eissn>1864-1245</eissn><abstract>A ceramic substrate bonded to an electronic sensor was reported to crack during thermal testing between −46 and +71 °C. Initially, this was assumed to occur at high temperature because of the thermal expansion of a polymer pad under the sensor. However, further investigations indicated that fracture was also occurring at low temperature. This was surprising since the suspected cause of fracture was pressure exerted by the polymer pad under the ceramic. This polymer pad has a coefficient of thermal expansion much greater than any other component. Conventional wisdom suggests that this failure would happen only during expansion of the pad during high temperature phases of temperature cycling. Subsequent dynamic thermal analysis revealed that differential contraction of the steel clamp fasteners was causing pressure to be exerted on the ceramic during the initial phase of the cold cycle. In addition, lateral constraint of the polymer pad caused pressure to rise to counterintuitive levels. An alteration of the geometry of the pad proved to be the simplest and most economical solution. This was confirmed by subsequent testing.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11668-011-9483-7</doi><tpages>3</tpages></addata></record> |
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| subjects | Applied sciences Building materials. Ceramics. Glasses Case History---Peer-Reviewed Ceramic industries Ceramics Characterization and Evaluation of Materials Chemical industry and chemicals Chemistry and Materials Science Classical Mechanics Condensed matter: structure, mechanical and thermal properties Corrosion and Coatings Economics Electronics Electrotechnical and electronic ceramics Exact sciences and technology Failure Fatigue, brittleness, fracture, and cracks Fracture mechanics Fracture mechanics (crack, fatigue, damage...) Fundamental areas of phenomenology (including applications) General equipment and techniques Instruments, apparatus, components and techniques common to several branches of physics and astronomy Materials Science Mechanical and acoustical properties of condensed matter Mechanical properties of solids Phases Physics Quality Control Reliability Safety and Risk Sensors Sensors (chemical, optical, electrical, movement, gas, etc.) remote sensing Solid Mechanics Structural and continuum mechanics Technical ceramics Thermal expansion Tribology |
| title | Unexpected Thermal Fracture of a Ceramic Sensor |
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