The effect of substrate surface roughness on the wettability of Sn-Bi solders
The effect of substrate surface roughness on the wettability of Sn-Bi solders is investigated by the eutectic Sn-Bi alloy on Cu/Al^sub 2^O^sub 3^ substrates at 190 °C. To engineer the surface with different roughnesses, the Cu-side of the substrates is polished with sandpaper with abrasive number 10...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2000-06, Vol.11 (4), p.279-283 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | Chen, Yi-yu Duh, Jenq-gong Chiou, Bi-shiou |
| description | The effect of substrate surface roughness on the wettability of Sn-Bi solders is investigated by the eutectic Sn-Bi alloy on Cu/Al^sub 2^O^sub 3^ substrates at 190 °C. To engineer the surface with different roughnesses, the Cu-side of the substrates is polished with sandpaper with abrasive number 100, 240, 400, 600, 800, 1200, and 1 μm alumina powder, respectively. Both dynamic and static contact angles of the solder drops are studied by the real-time image in a dynamic contact angle analyzer system (FTA200). During dynamic wetting, the wetting velocity of the solder drop decreases for the rougher surface. However, the time to reach the static contact angle seems to be identical with different substrate surface roughness. The wetting tip of the solder cap exhibits a waveform on the rough surface, indicating that the liquid drop tends to flow along the valley. As the solder drops reach a static state, the static contact angle increases with the substrate surface roughness. This demonstrates that the wettability of solders degrades as the substrates become rough.[PUBLICATION ABSTRACT] |
| doi_str_mv | 10.1023/A:1008917530144 |
| format | Article |
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To engineer the surface with different roughnesses, the Cu-side of the substrates is polished with sandpaper with abrasive number 100, 240, 400, 600, 800, 1200, and 1 μm alumina powder, respectively. Both dynamic and static contact angles of the solder drops are studied by the real-time image in a dynamic contact angle analyzer system (FTA200). During dynamic wetting, the wetting velocity of the solder drop decreases for the rougher surface. However, the time to reach the static contact angle seems to be identical with different substrate surface roughness. The wetting tip of the solder cap exhibits a waveform on the rough surface, indicating that the liquid drop tends to flow along the valley. As the solder drops reach a static state, the static contact angle increases with the substrate surface roughness. This demonstrates that the wettability of solders degrades as the substrates become rough.[PUBLICATION ABSTRACT]</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1023/A:1008917530144</identifier><language>eng</language><publisher>New York: Springer Nature B.V</publisher><subject>Alloy powders ; Contact angle ; Dynamical systems ; Dynamics ; Solders ; Surface roughness ; Wettability ; Wetting</subject><ispartof>Journal of materials science. 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Materials in electronics</title><description>The effect of substrate surface roughness on the wettability of Sn-Bi solders is investigated by the eutectic Sn-Bi alloy on Cu/Al^sub 2^O^sub 3^ substrates at 190 °C. To engineer the surface with different roughnesses, the Cu-side of the substrates is polished with sandpaper with abrasive number 100, 240, 400, 600, 800, 1200, and 1 μm alumina powder, respectively. Both dynamic and static contact angles of the solder drops are studied by the real-time image in a dynamic contact angle analyzer system (FTA200). During dynamic wetting, the wetting velocity of the solder drop decreases for the rougher surface. However, the time to reach the static contact angle seems to be identical with different substrate surface roughness. The wetting tip of the solder cap exhibits a waveform on the rough surface, indicating that the liquid drop tends to flow along the valley. As the solder drops reach a static state, the static contact angle increases with the substrate surface roughness. This demonstrates that the wettability of solders degrades as the substrates become rough.[PUBLICATION ABSTRACT]</description><subject>Alloy powders</subject><subject>Contact angle</subject><subject>Dynamical systems</subject><subject>Dynamics</subject><subject>Solders</subject><subject>Surface roughness</subject><subject>Wettability</subject><subject>Wetting</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2000</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNqNzz1LBDEQBuAgCp6nte1iodXq5Dtrdx5-wYmFJ9gdSXbi7bFudJNF_PeuaGUhVjO8PPPCEHJI4ZQC42ezcwpgKqolByrEFplQqXkpDHvaJhOopC6FZGyX7KW0AQAluJmQu-UaCwwBfS5iKNLgUu5txnHrg_VY9HF4XneYUhG7Io_4HXO2rmmb_PF18dCVF02RYltjn_bJTrBtwoOfOSWPV5fL-U25uL--nc8WpecMcskEx1qi55qjqGglfLCBIRhgaswcaGMlCumYdECdklpwT30tvAvOyppPycl372sf3wZMefXSJI9tazuMQ1pVTDEDUNFRHv8pmdZCccX-BSlT1QiPfsFNHPpufHdljDBGCa34J4Jkd9I</recordid><startdate>20000601</startdate><enddate>20000601</enddate><creator>Chen, Yi-yu</creator><creator>Duh, Jenq-gong</creator><creator>Chiou, Bi-shiou</creator><general>Springer Nature B.V</general><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PHGZM</scope><scope>PHGZT</scope><scope>PKEHL</scope><scope>PQEST</scope><scope>PQGLB</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope><scope>H8D</scope><scope>7QF</scope></search><sort><creationdate>20000601</creationdate><title>The effect of substrate surface roughness on the wettability of Sn-Bi solders</title><author>Chen, Yi-yu ; Duh, Jenq-gong ; Chiou, Bi-shiou</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c320t-243ed5ec373e49194cfaf2e08026373b078a5e45b25b01b65743c1cd4cbfba5d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Alloy powders</topic><topic>Contact angle</topic><topic>Dynamical systems</topic><topic>Dynamics</topic><topic>Solders</topic><topic>Surface roughness</topic><topic>Wettability</topic><topic>Wetting</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Yi-yu</creatorcontrib><creatorcontrib>Duh, Jenq-gong</creatorcontrib><creatorcontrib>Chiou, Bi-shiou</creatorcontrib><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest Central (New)</collection><collection>ProQuest One Academic (New)</collection><collection>ProQuest One Academic Middle East (New)</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Applied & Life Sciences</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><collection>Aerospace Database</collection><collection>Aluminium Industry Abstracts</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Yi-yu</au><au>Duh, Jenq-gong</au><au>Chiou, Bi-shiou</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The effect of substrate surface roughness on the wettability of Sn-Bi solders</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><date>2000-06-01</date><risdate>2000</risdate><volume>11</volume><issue>4</issue><spage>279</spage><epage>283</epage><pages>279-283</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>The effect of substrate surface roughness on the wettability of Sn-Bi solders is investigated by the eutectic Sn-Bi alloy on Cu/Al^sub 2^O^sub 3^ substrates at 190 °C. To engineer the surface with different roughnesses, the Cu-side of the substrates is polished with sandpaper with abrasive number 100, 240, 400, 600, 800, 1200, and 1 μm alumina powder, respectively. Both dynamic and static contact angles of the solder drops are studied by the real-time image in a dynamic contact angle analyzer system (FTA200). During dynamic wetting, the wetting velocity of the solder drop decreases for the rougher surface. However, the time to reach the static contact angle seems to be identical with different substrate surface roughness. The wetting tip of the solder cap exhibits a waveform on the rough surface, indicating that the liquid drop tends to flow along the valley. As the solder drops reach a static state, the static contact angle increases with the substrate surface roughness. This demonstrates that the wettability of solders degrades as the substrates become rough.[PUBLICATION ABSTRACT]</abstract><cop>New York</cop><pub>Springer Nature B.V</pub><doi>10.1023/A:1008917530144</doi><tpages>5</tpages></addata></record> |
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| ispartof | Journal of materials science. Materials in electronics, 2000-06, Vol.11 (4), p.279-283 |
| issn | 0957-4522 1573-482X |
| language | eng |
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| source | SpringerLink Journals |
| subjects | Alloy powders Contact angle Dynamical systems Dynamics Solders Surface roughness Wettability Wetting |
| title | The effect of substrate surface roughness on the wettability of Sn-Bi solders |
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