Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRI...
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| Veröffentlicht in: | Journal of microelectromechanical systems 1999-12, Vol.8 (4), p.456-465 |
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| container_end_page | 465 |
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| container_issue | 4 |
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| container_title | Journal of microelectromechanical systems |
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| creator | Yeh, J.-L.A. Hongrui Jiang Tien, N.C. |
| description | This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining. |
| doi_str_mv | 10.1109/84.809061 |
| format | Article |
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The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining.</description><subject>Actuators</subject><subject>Anisotropic magnetoresistance</subject><subject>Biomembranes</subject><subject>Design engineering</subject><subject>Electrostatic actuators</subject><subject>Etching</subject><subject>Exact sciences and technology</subject><subject>Fabrication</subject><subject>Fingers</subject><subject>Flexibility</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Mechanical instruments, equipment and techniques</subject><subject>Microelectromechanical systems</subject><subject>Micromachining</subject><subject>Micromechanical devices and systems</subject><subject>Physics</subject><subject>Reactive ion etching</subject><subject>Resonant frequency</subject><subject>Semiconducting silicon</subject><subject>Silicon</subject><subject>Surface topography</subject><issn>1057-7157</issn><issn>1941-0158</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqF0T1PHDEQBuBVlEgQoKBN5SIiSrHg2fX6o0QHCSchRUKhXs16x2DiWx-2r-DfZ093CR1UtsfPvMVMVZ0CPwfg5kKLc80Nl_ChOgQjoObQ6Y_znXeqVtCpg-pzzk-cgxBaHlZ2ORV6SFhoZOsYXrIP3saJ4TSyq7vlNRs24Q_7V115m-IK7aOf_PTAXEwzZBTIlhRzweItKzFlHycMDG3Z4Pw8rj45DJlO9udRdf_j-vfipr799XO5uLytrVBQ6gEdDc2oRjEgCjsadO3oFDhqgEvSXBjJO9fqgTdOk-BWa2rlaJU2AA7bo-rbLned4vOGculXPlsKASeKm9wbMKZtQOh3pRISpAS-lWdvykYLpYzewu87OE8o50SuXye_wvTSA--3q-m16Herme3XfShmi8ElnKzPrw0NyI43M_uyY56I_v_uM_4CyheXHw</recordid><startdate>19991201</startdate><enddate>19991201</enddate><creator>Yeh, J.-L.A.</creator><creator>Hongrui Jiang</creator><creator>Tien, N.C.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7TB</scope><scope>7U5</scope><scope>8FD</scope><scope>FR3</scope><scope>L7M</scope><scope>7TC</scope><scope>F28</scope></search><sort><creationdate>19991201</creationdate><title>Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator</title><author>Yeh, J.-L.A. ; Hongrui Jiang ; Tien, N.C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c471t-bafeb2d7d4baa4cd9af3df71fe2106e8049605f38b02f8e40c88e36dc78911fa3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Actuators</topic><topic>Anisotropic magnetoresistance</topic><topic>Biomembranes</topic><topic>Design engineering</topic><topic>Electrostatic actuators</topic><topic>Etching</topic><topic>Exact sciences and technology</topic><topic>Fabrication</topic><topic>Fingers</topic><topic>Flexibility</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Mechanical instruments, equipment and techniques</topic><topic>Microelectromechanical systems</topic><topic>Micromachining</topic><topic>Micromechanical devices and systems</topic><topic>Physics</topic><topic>Reactive ion etching</topic><topic>Resonant frequency</topic><topic>Semiconducting silicon</topic><topic>Silicon</topic><topic>Surface topography</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yeh, J.-L.A.</creatorcontrib><creatorcontrib>Hongrui Jiang</creatorcontrib><creatorcontrib>Tien, N.C.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical Engineering Abstracts</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><jtitle>Journal of microelectromechanical systems</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yeh, J.-L.A.</au><au>Hongrui Jiang</au><au>Tien, N.C.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator</atitle><jtitle>Journal of microelectromechanical systems</jtitle><stitle>JMEMS</stitle><date>1999-12-01</date><risdate>1999</risdate><volume>8</volume><issue>4</issue><spage>456</spage><epage>465</epage><pages>456-465</pages><issn>1057-7157</issn><eissn>1941-0158</eissn><coden>JMIYET</coden><abstract>This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows the combdrive to be integrated with any structure made by polysilicon surface micromachining.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/84.809061</doi><tpages>10</tpages><oa>free_for_read</oa></addata></record> |
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| identifier | ISSN: 1057-7157 |
| ispartof | Journal of microelectromechanical systems, 1999-12, Vol.8 (4), p.456-465 |
| issn | 1057-7157 1941-0158 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_919932148 |
| source | IEEE Electronic Library (IEL) |
| subjects | Actuators Anisotropic magnetoresistance Biomembranes Design engineering Electrostatic actuators Etching Exact sciences and technology Fabrication Fingers Flexibility Instruments, apparatus, components and techniques common to several branches of physics and astronomy Mechanical instruments, equipment and techniques Microelectromechanical systems Micromachining Micromechanical devices and systems Physics Reactive ion etching Resonant frequency Semiconducting silicon Silicon Surface topography |
| title | Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator |
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