Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250-325 deg C, and the morphology of intermetallic compounds formed after such soldering reactions is observed. In kinetics analysis of the growths of intermetallic compound...

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Veröffentlicht in:	Journal of materials engineering and performance 2002-10, Vol.11 (5), p.481-486
Hauptverfasser:	SU, T. L, TSAO, L. C, CHANG, S. Y, CHUANG, T. H
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Exact sciences and technology Interface reactions Intermetallic compounds Intermetallics Joining, thermal cutting: metallurgical aspects Liquids Metals. Metallurgy Silver Solders Thick films Tin Tin base alloys
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