Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies

► Janus Green B and safranine are prototypical redox-active leveler additives for copper electroplating. ► Their redox-transitions lie within the copper potential window. ► Reduced additives are identified as active species for the leveling effect. ► Electro-reduction affects in particular the centr...

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Veröffentlicht in:	Electrochimica acta 2011-08, Vol.56 (21), p.7361-7370
Hauptverfasser:	Hai, N.T.M., Huynh, T.M.T., Fluegel, A., Mayer, D., Broekmann, P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Copper Copper plating Dyes Electronics Exact sciences and technology Leveling Microelectronic fabrication (materials and surfaces technology) Precipitation Redox-chemistry Retarding Scanning tunneling microscopy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices STM Suppressor additives Surface chemistry Three dimensional
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