A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching
This work is designed to study crack development and resistance changes in aluminum thin films under stretching. Crack development and relative electrical resistance change (∆R/R 0) of aluminum thin film on 127-μm poly ethylene terephthalate substrates were investigated as a function of engineering...
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| Veröffentlicht in: | Thin solid films 2011-09, Vol.519 (22), p.7918-7924 |
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| creator | Hamasha, Mohammad M. Alzoubi, Khalid Switzer, James C. Lu, Susan Desu, Seshu B. Poliks, Mark |
| description | This work is designed to study crack development and resistance changes in aluminum thin films under stretching. Crack development and relative electrical resistance change (∆R/R
0) of aluminum thin film on 127-μm poly ethylene terephthalate substrates were investigated as a function of engineering strain. Four thicknesses were considered for the aluminum thin films: 50, 100, 200, and 500
nm. The engineering stress–engineering strain curves were very similar for all thicknesses. Three strain rates were considered in this study: 0.1
min
−
1
, 0.5
min
−
1
and 1.0
min
−
1
. Before the yield point, there was no stress difference under different strain rates. However, after the yield point, stress was higher at a higher strain rate. It was found that ∆R/R
0 was very sensitive to the film thickness. Optical microscope images at high magnification showed that cracks were observed at 2% strain for 100, 200, and 500
nm-thick films and at 8% strain for the 50
nm-thick films. Short lateral cracks (perpendicular to the original cracks) were observed at 20% strain for the 100 and 200
nm thick films and at 30% for the 500
nm thick films. |
| doi_str_mv | 10.1016/j.tsf.2011.06.062 |
| format | Article |
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0) of aluminum thin film on 127-μm poly ethylene terephthalate substrates were investigated as a function of engineering strain. Four thicknesses were considered for the aluminum thin films: 50, 100, 200, and 500
nm. The engineering stress–engineering strain curves were very similar for all thicknesses. Three strain rates were considered in this study: 0.1
min
−
1
, 0.5
min
−
1
and 1.0
min
−
1
. Before the yield point, there was no stress difference under different strain rates. However, after the yield point, stress was higher at a higher strain rate. It was found that ∆R/R
0 was very sensitive to the film thickness. Optical microscope images at high magnification showed that cracks were observed at 2% strain for 100, 200, and 500
nm-thick films and at 8% strain for the 50
nm-thick films. Short lateral cracks (perpendicular to the original cracks) were observed at 20% strain for the 100 and 200
nm thick films and at 30% for the 500
nm thick films.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2011.06.062</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Aluminum ; Condensed matter: structure, mechanical and thermal properties ; Crack propagation ; Cracks ; Cross-disciplinary physics: materials science; rheology ; Deposition by sputtering ; Electrical resistance ; Ethylene ; Exact sciences and technology ; Materials science ; Mechanical and acoustical properties ; Methods of deposition of films and coatings; film growth and epitaxy ; Physical properties of thin films, nonelectronic ; Physics ; Poly ethylene terephthalate ; Strain ; Strain rate ; Stretching ; Structure and morphology; thickness ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thick films ; Thin film structure and morphology ; Thin films</subject><ispartof>Thin solid films, 2011-09, Vol.519 (22), p.7918-7924</ispartof><rights>2011</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c425t-968913fbdbe2e7671196e63e9a2b6d5f8d2b512752a7a68fcbe8879947d550463</citedby><cites>FETCH-LOGICAL-c425t-968913fbdbe2e7671196e63e9a2b6d5f8d2b512752a7a68fcbe8879947d550463</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0040609011013393$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=24506025$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Hamasha, Mohammad M.</creatorcontrib><creatorcontrib>Alzoubi, Khalid</creatorcontrib><creatorcontrib>Switzer, James C.</creatorcontrib><creatorcontrib>Lu, Susan</creatorcontrib><creatorcontrib>Desu, Seshu B.</creatorcontrib><creatorcontrib>Poliks, Mark</creatorcontrib><title>A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching</title><title>Thin solid films</title><description>This work is designed to study crack development and resistance changes in aluminum thin films under stretching. Crack development and relative electrical resistance change (∆R/R
0) of aluminum thin film on 127-μm poly ethylene terephthalate substrates were investigated as a function of engineering strain. Four thicknesses were considered for the aluminum thin films: 50, 100, 200, and 500
nm. The engineering stress–engineering strain curves were very similar for all thicknesses. Three strain rates were considered in this study: 0.1
min
−
1
, 0.5
min
−
1
and 1.0
min
−
1
. Before the yield point, there was no stress difference under different strain rates. However, after the yield point, stress was higher at a higher strain rate. It was found that ∆R/R
0 was very sensitive to the film thickness. Optical microscope images at high magnification showed that cracks were observed at 2% strain for 100, 200, and 500
nm-thick films and at 8% strain for the 50
nm-thick films. Short lateral cracks (perpendicular to the original cracks) were observed at 20% strain for the 100 and 200
nm thick films and at 30% for the 500
nm thick films.</description><subject>Aluminum</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Crack propagation</subject><subject>Cracks</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Deposition by sputtering</subject><subject>Electrical resistance</subject><subject>Ethylene</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Mechanical and acoustical properties</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physical properties of thin films, nonelectronic</subject><subject>Physics</subject><subject>Poly ethylene terephthalate</subject><subject>Strain</subject><subject>Strain rate</subject><subject>Stretching</subject><subject>Structure and morphology; thickness</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thick films</subject><subject>Thin film structure and morphology</subject><subject>Thin films</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><recordid>eNp9UcGKFDEQDaLguPoB3nIRTz2bpLuTDp6WxVVhYS96DumkMp0xnW6TtDBf4u-aZhaPQkEV4b1XqfcQek_JkRLKb8_Hkt2REUqPhNdiL9CBDkI2TLT0JToQ0pGGE0leozc5nwkhlLH2gP7c4Vw2e8FLxCZp8xOvaVn1SRdfX3S0GAKYkrzRASfIPhcdDWAz6XgCvDic160USGCxDtvs4zbjMvmInQ_zrrou4YKhTJcAEfCOXKcy6aAL4LyNuaR92qKFVL-SoJjKPr1Fr5wOGd499xv04-Hz9_uvzePTl2_3d4-N6VhfGskHSVs32hEYCC4olRx4C1KzkdveDZaNPWWiZ1poPjgzwlBdkZ2wfU863t6gj1fdevavDXJRs88GQtARli0rSaVkRAhWkfSKNGnJOYFTa_KzThdFidozUGdVM1B7BorwWjvnw7O6ztVAl6p3Pv8jsq4nnLC-4j5dcVBP_e0hqWw8VJ-tT9V9ZRf_ny1_Afqin9w</recordid><startdate>20110901</startdate><enddate>20110901</enddate><creator>Hamasha, Mohammad M.</creator><creator>Alzoubi, Khalid</creator><creator>Switzer, James C.</creator><creator>Lu, Susan</creator><creator>Desu, Seshu B.</creator><creator>Poliks, Mark</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20110901</creationdate><title>A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching</title><author>Hamasha, Mohammad M. ; Alzoubi, Khalid ; Switzer, James C. ; Lu, Susan ; Desu, Seshu B. ; Poliks, Mark</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c425t-968913fbdbe2e7671196e63e9a2b6d5f8d2b512752a7a68fcbe8879947d550463</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>Aluminum</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Crack propagation</topic><topic>Cracks</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Deposition by sputtering</topic><topic>Electrical resistance</topic><topic>Ethylene</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Mechanical and acoustical properties</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physical properties of thin films, nonelectronic</topic><topic>Physics</topic><topic>Poly ethylene terephthalate</topic><topic>Strain</topic><topic>Strain rate</topic><topic>Stretching</topic><topic>Structure and morphology; thickness</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thick films</topic><topic>Thin film structure and morphology</topic><topic>Thin films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hamasha, Mohammad M.</creatorcontrib><creatorcontrib>Alzoubi, Khalid</creatorcontrib><creatorcontrib>Switzer, James C.</creatorcontrib><creatorcontrib>Lu, Susan</creatorcontrib><creatorcontrib>Desu, Seshu B.</creatorcontrib><creatorcontrib>Poliks, Mark</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hamasha, Mohammad M.</au><au>Alzoubi, Khalid</au><au>Switzer, James C.</au><au>Lu, Susan</au><au>Desu, Seshu B.</au><au>Poliks, Mark</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching</atitle><jtitle>Thin solid films</jtitle><date>2011-09-01</date><risdate>2011</risdate><volume>519</volume><issue>22</issue><spage>7918</spage><epage>7924</epage><pages>7918-7924</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>This work is designed to study crack development and resistance changes in aluminum thin films under stretching. Crack development and relative electrical resistance change (∆R/R
0) of aluminum thin film on 127-μm poly ethylene terephthalate substrates were investigated as a function of engineering strain. Four thicknesses were considered for the aluminum thin films: 50, 100, 200, and 500
nm. The engineering stress–engineering strain curves were very similar for all thicknesses. Three strain rates were considered in this study: 0.1
min
−
1
, 0.5
min
−
1
and 1.0
min
−
1
. Before the yield point, there was no stress difference under different strain rates. However, after the yield point, stress was higher at a higher strain rate. It was found that ∆R/R
0 was very sensitive to the film thickness. Optical microscope images at high magnification showed that cracks were observed at 2% strain for 100, 200, and 500
nm-thick films and at 8% strain for the 50
nm-thick films. Short lateral cracks (perpendicular to the original cracks) were observed at 20% strain for the 100 and 200
nm thick films and at 30% for the 500
nm thick films.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.tsf.2011.06.062</doi><tpages>7</tpages></addata></record> |
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| subjects | Aluminum Condensed matter: structure, mechanical and thermal properties Crack propagation Cracks Cross-disciplinary physics: materials science rheology Deposition by sputtering Electrical resistance Ethylene Exact sciences and technology Materials science Mechanical and acoustical properties Methods of deposition of films and coatings film growth and epitaxy Physical properties of thin films, nonelectronic Physics Poly ethylene terephthalate Strain Strain rate Stretching Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thick films Thin film structure and morphology Thin films |
| title | A study on crack propagation and electrical resistance change of sputtered aluminum thin film on poly ethylene terephthalate substrate under stretching |
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