Ceramic filled thermoplastic encapsulation as a design feature for a BLDC motor in a disk drive
Thermoplastics have made steady gains in use in a wide variety of motor applications. One of the few areas in which thermoplastics have not been effectively utilized are spindle motors. Central to the development of these applications is an understanding of the heat transfer and harmonic damping req...
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| Veröffentlicht in: | IEEE transactions on magnetics 2001-03, Vol.37 (2), p.793-798 |
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| container_end_page | 798 |
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| container_issue | 2 |
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| container_title | IEEE transactions on magnetics |
| container_volume | 37 |
| creator | Neal, G.D. Ohsang Kwon Lieu, D.K. |
| description | Thermoplastics have made steady gains in use in a wide variety of motor applications. One of the few areas in which thermoplastics have not been effectively utilized are spindle motors. Central to the development of these applications is an understanding of the heat transfer and harmonic damping requirements of the applications and the cost/benefit relationships that exist. A simple model will be presented in which the heat transfer requirements for thermally conductive plastics can be understood and their costs can be estimated. Various filler systems and their performance will be discussed highlighting motor designs where these materials offer a competitive alternative to traditional construction techniques. |
| doi_str_mv | 10.1109/20.917618 |
| format | Article |
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One of the few areas in which thermoplastics have not been effectively utilized are spindle motors. Central to the development of these applications is an understanding of the heat transfer and harmonic damping requirements of the applications and the cost/benefit relationships that exist. A simple model will be presented in which the heat transfer requirements for thermally conductive plastics can be understood and their costs can be estimated. Various filler systems and their performance will be discussed highlighting motor designs where these materials offer a competitive alternative to traditional construction techniques.</description><identifier>ISSN: 0018-9464</identifier><identifier>EISSN: 1941-0069</identifier><identifier>DOI: 10.1109/20.917618</identifier><identifier>CODEN: IEMGAQ</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Brushless DC motors ; Ceramics ; Conducting materials ; Copper ; Costs ; Damping ; Design engineering ; Disk drives ; Electric motors ; Electrical engineering. 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One of the few areas in which thermoplastics have not been effectively utilized are spindle motors. Central to the development of these applications is an understanding of the heat transfer and harmonic damping requirements of the applications and the cost/benefit relationships that exist. A simple model will be presented in which the heat transfer requirements for thermally conductive plastics can be understood and their costs can be estimated. Various filler systems and their performance will be discussed highlighting motor designs where these materials offer a competitive alternative to traditional construction techniques.</description><subject>Applied sciences</subject><subject>Brushless DC motors</subject><subject>Ceramics</subject><subject>Conducting materials</subject><subject>Copper</subject><subject>Costs</subject><subject>Damping</subject><subject>Design engineering</subject><subject>Disk drives</subject><subject>Electric motors</subject><subject>Electrical engineering. Electrical power engineering</subject><subject>Electrical machines</subject><subject>Encapsulation</subject><subject>Exact sciences and technology</subject><subject>Heat transfer</subject><subject>Magnetism</subject><subject>Motors</subject><subject>Temperature</subject><subject>Thermal conductivity</subject><subject>Thermoplastic resins</subject><issn>0018-9464</issn><issn>1941-0069</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNqN0cuLFDEQB-AgCo6rB6-egoKLh16r0uk8juu4PmDAi55DNl3RrP0Yk27B_94MvSh4UE9FVb76HVKMPUa4QAT7UsCFRa3Q3GE7tBIbAGXvsh0AmsZKJe-zB6Xc1FZ2CDvm9pT9mAKPaRio58sXyuN8HHxZ6pCm4I9lHfyS5on7wj3vqaTPE4_klzUTj3Ouw1eH13s-zktt0nRCqXzlfU7f6SG7F_1Q6NFtPWOf3lx93L9rDh_evt9fHpoghVoarXyvMEatr_vQ2mA70IGMgIjCklUSgJQw3kqK-rrzFqOgVmOQ1giivj1j51vuMc_fViqLG1MJNAx-onktzqJUnemErvL5X6UwWgrTyf-AQiCY9t9QKa0tQoVP_4A385qn-i_OGGnQgBQVvdhQyHMpmaI75jT6_MMhuNONnQC33bjaZ7eBvgQ_xOynkMqvBduprj0lPtlUIqLfj1vET5iAq4M</recordid><startdate>20010301</startdate><enddate>20010301</enddate><creator>Neal, G.D.</creator><creator>Ohsang Kwon</creator><creator>Lieu, D.K.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Electrical power engineering</topic><topic>Electrical machines</topic><topic>Encapsulation</topic><topic>Exact sciences and technology</topic><topic>Heat transfer</topic><topic>Magnetism</topic><topic>Motors</topic><topic>Temperature</topic><topic>Thermal conductivity</topic><topic>Thermoplastic resins</topic><toplevel>online_resources</toplevel><creatorcontrib>Neal, G.D.</creatorcontrib><creatorcontrib>Ohsang Kwon</creatorcontrib><creatorcontrib>Lieu, D.K.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on magnetics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Neal, G.D.</au><au>Ohsang Kwon</au><au>Lieu, D.K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Ceramic filled thermoplastic encapsulation as a design feature for a BLDC motor in a disk drive</atitle><jtitle>IEEE transactions on magnetics</jtitle><stitle>TMAG</stitle><date>2001-03-01</date><risdate>2001</risdate><volume>37</volume><issue>2</issue><spage>793</spage><epage>798</epage><pages>793-798</pages><issn>0018-9464</issn><eissn>1941-0069</eissn><coden>IEMGAQ</coden><abstract>Thermoplastics have made steady gains in use in a wide variety of motor applications. One of the few areas in which thermoplastics have not been effectively utilized are spindle motors. Central to the development of these applications is an understanding of the heat transfer and harmonic damping requirements of the applications and the cost/benefit relationships that exist. A simple model will be presented in which the heat transfer requirements for thermally conductive plastics can be understood and their costs can be estimated. Various filler systems and their performance will be discussed highlighting motor designs where these materials offer a competitive alternative to traditional construction techniques.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/20.917618</doi><tpages>6</tpages></addata></record> |
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| ispartof | IEEE transactions on magnetics, 2001-03, Vol.37 (2), p.793-798 |
| issn | 0018-9464 1941-0069 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_914658527 |
| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Brushless DC motors Ceramics Conducting materials Copper Costs Damping Design engineering Disk drives Electric motors Electrical engineering. Electrical power engineering Electrical machines Encapsulation Exact sciences and technology Heat transfer Magnetism Motors Temperature Thermal conductivity Thermoplastic resins |
| title | Ceramic filled thermoplastic encapsulation as a design feature for a BLDC motor in a disk drive |
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