Comparison of low-melting lead-free solders in tensile properties with Sn-Pb eutectic solder
The tensile properties of Sn-8 mass % Zn-3 mass % Bi and Sn-58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is a...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2004-04, Vol.15 (4), p.219-223 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | SHOHJI, Ikuo YOSHIDA, Tomohiro TAKAHASHI, Takehiko HIOKI, Susumu |
| description | The tensile properties of Sn-8 mass % Zn-3 mass % Bi and Sn-58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is approximately double that of the Sn-Pb solder at room temperature (RT). The ductility of each solder is inferior to that of the Sn-Pb solder. From the results of strain-rate-change tests, the stress exponents and the activation energies for creep of Sn-58Bi and Sn-8Zn-3Bi were also examined. |
| doi_str_mv | 10.1023/B:JMSE.0000012458.57604.db |
| format | Article |
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The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is approximately double that of the Sn-Pb solder at room temperature (RT). The ductility of each solder is inferior to that of the Sn-Pb solder. From the results of strain-rate-change tests, the stress exponents and the activation energies for creep of Sn-58Bi and Sn-8Zn-3Bi were also examined.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1023/B:JMSE.0000012458.57604.db</identifier><language>eng</language><publisher>Norwell, MA: Springer</publisher><subject>Applied sciences ; Brazing. Soldering ; Creep ; Creep (materials) ; Electronics ; Eutectic temperature ; Exact sciences and technology ; Joining, thermal cutting: metallurgical aspects ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metallurgy ; Metals. 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Materials in electronics</title><description>The tensile properties of Sn-8 mass % Zn-3 mass % Bi and Sn-58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is approximately double that of the Sn-Pb solder at room temperature (RT). The ductility of each solder is inferior to that of the Sn-Pb solder. From the results of strain-rate-change tests, the stress exponents and the activation energies for creep of Sn-58Bi and Sn-8Zn-3Bi were also examined.</description><subject>Applied sciences</subject><subject>Brazing. 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| ispartof | Journal of materials science. Materials in electronics, 2004-04, Vol.15 (4), p.219-223 |
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| source | SpringerNature Journals |
| subjects | Applied sciences Brazing. Soldering Creep Creep (materials) Electronics Eutectic temperature Exact sciences and technology Joining, thermal cutting: metallurgical aspects Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metallurgy Metals. Metallurgy Soldering Solders Strain rate Tensile properties Tensile strength Tin |
| title | Comparison of low-melting lead-free solders in tensile properties with Sn-Pb eutectic solder |
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