Comparison of low-melting lead-free solders in tensile properties with Sn-Pb eutectic solder

The tensile properties of Sn-8 mass % Zn-3 mass % Bi and Sn-58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of materials science. Materials in electronics 2004-04, Vol.15 (4), p.219-223
Hauptverfasser:	SHOHJI, Ikuo, YOSHIDA, Tomohiro, TAKAHASHI, Takehiko, HIOKI, Susumu
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Creep Creep (materials) Electronics Eutectic temperature Exact sciences and technology Joining, thermal cutting: metallurgical aspects Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metallurgy Metals. Metallurgy Soldering Solders Strain rate Tensile properties Tensile strength Tin
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The tensile properties of Sn-8 mass % Zn-3 mass % Bi and Sn-58 mass % Bi low-melting lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength decreases with decreasing strain rate and increasing temperature. The tensile strength of each solder is approximately double that of the Sn-Pb solder at room temperature (RT). The ductility of each solder is inferior to that of the Sn-Pb solder. From the results of strain-rate-change tests, the stress exponents and the activation energies for creep of Sn-58Bi and Sn-8Zn-3Bi were also examined.
ISSN:	0957-4522 1573-482X
DOI:	10.1023/B:JMSE.0000012458.57604.db