Stress analysis of Si sub(1-) sub(x)Ge sub(x embedded source/drain junctions)

The purpose of this paper is to evaluate the impact of the geometry of embedded Si sub(1-) sub(x)Ge sub(x source/drain junctions on the stress field. Stress simulations were performed using TSUPREM4 2D software to further investigate the elastic strain relaxation as a function of Si) sub(1)- sub(xGe...

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Veröffentlicht in:Materials science in semiconductor processing 2008-10, Vol.11 (5-6), p.285-290
Hauptverfasser: Gonzalez, MBargallo, Simoen, E, Naka, N, Okuno, Y, Eneman, G, Hikavyy, A, Verheyen, P, Loo, R, Claeys, C, Machkaoutsan, V, Tomasini, P, Thomas, S G, Lu, J P, Wise, R
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container_end_page 290
container_issue 5-6
container_start_page 285
container_title Materials science in semiconductor processing
container_volume 11
creator Gonzalez, MBargallo
Simoen, E
Naka, N
Okuno, Y
Eneman, G
Hikavyy, A
Verheyen, P
Loo, R
Claeys, C
Machkaoutsan, V
Tomasini, P
Thomas, S G
Lu, J P
Wise, R
description The purpose of this paper is to evaluate the impact of the geometry of embedded Si sub(1-) sub(x)Ge sub(x source/drain junctions on the stress field. Stress simulations were performed using TSUPREM4 2D software to further investigate the elastic strain relaxation as a function of Si) sub(1)- sub(xGe) sub(x) alloy active size, in the regime where no plastic relaxation is present. Moreover, the role of the epilayer thickness and the Ge content on the stress levels is also discussed. The work is complemented with experimental Raman spectroscopy.
doi_str_mv 10.1016/j.mssp.2008.09.013
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source Elsevier ScienceDirect Journals Complete
subjects Computer programs
Drains
Germanium
Semiconductors
Simulation
Strain relaxation
Stress relaxation
Stresses
title Stress analysis of Si sub(1-) sub(x)Ge sub(x embedded source/drain junctions)
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