Design and performance evaluation of a compact thermosyphon

Thermosyphons are a promising option for cooling of high heat dissipating electronics. In this paper, the first known implementation of a compact two-phase thermosyphon for cooling of a microprocessor in a commercial desktop computer is presented. The implemented thermosyphon involves four component...

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Veröffentlicht in:	IEEE transactions on components and packaging technologies 2002-12, Vol.25 (4), p.601-607
Hauptverfasser:	Pal, A., Joshi, Y.K., Beitelmal, M.H., Patel, C.D., Wenger, T.M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Boiling Computer simulation Computerized monitoring Condition monitoring Cooling Copper Electronics Electronics cooling Heat transfer Laboratories Liquid cooling Mathematical models Microprocessors Packaging Temperature Thermosyphons Tubes
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