Self-Healing Epoxy Composite with Heat-Resistant Healant
To provide self-healing epoxy composite with adequate heat resistance for high-performance application, we developed a novel microencapsulated epoxy/mercaptan healing agent. The key measure lies in usage of diglycidyl ether of bisphenol A (EPON 828) as the polymerizable component and 2,4,6-tris(dime...
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| Veröffentlicht in: | ACS applied materials & interfaces 2011-11, Vol.3 (11), p.4487-4495 |
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| container_title | ACS applied materials & interfaces |
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| creator | Yuan, Yan Chao Ye, Xiao Ji Rong, Min Zhi Zhang, Ming Qiu Yang, Gui Cheng Zhao, Jian Qing |
| description | To provide self-healing epoxy composite with adequate heat resistance for high-performance application, we developed a novel microencapsulated epoxy/mercaptan healing agent. The key measure lies in usage of diglycidyl ether of bisphenol A (EPON 828) as the polymerizable component and 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) as the catalyst. Because of the higher thermal stability of EPON 828 and lower volatility of DMP-30, the healing agent and the self-healing composite not only survive high-temperature curing and thermal exposure, but also offer satisfactory capability of autonomous properties restoration, as characterized by both fracture mechanics and fatigue tests. Especially when the operation temperature is not higher than 200 °C, the performance of the healing system is nearly independent of thermal history. |
| doi_str_mv | 10.1021/am201182j |
| format | Article |
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| title | Self-Healing Epoxy Composite with Heat-Resistant Healant |
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