Surface qualities after chemical–mechanical polishing on thin films

Demands for substrate and film surface planarizations significantly increase as the feature sizes of Integrated Circuit (IC) components continue to shrink. Chemical Mechanical Polishing (CMP), incorporating chemical and mechanical interactions to planarize chemically modified surface layers, has bee...

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Veröffentlicht in:	Thin solid films 2009-07, Vol.517 (17), p.4909-4915
Hauptverfasser:	Fu, Wei-En, Lin, Tzeng-Yow, Chen, Meng-Ke, Chen, Chao-Chang A.
Format:	Artikel
Sprache:	eng
Schlagworte:	CMP Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Physics Structure and morphology thickness Surface roughness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film Thin film structure and morphology Tungsten
Online-Zugang:	Volltext
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