Study on silicon-slicing technique using plasma-etching processing

Recently, the demand for the low kerf-loss slice of the silicon wafer for photovoltaic cells is increasing from the point of view of saving raw materials. In this work, we studied the silicon-slicing technique using plasma-etching processing, which is thought to be promising to reduce the kerf loss....

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Solar energy materials and solar cells 2009-06, Vol.93 (6), p.789-791
Hauptverfasser:	Yamaguchi, Mitsutaka, Abe, Yoshinori, Masuda, Atsushi, Kondo, Michio
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Energy Equipments, installations and applications Exact sciences and technology Natural energy Photovoltaic conversion Plasma-etching processing Slice Solar cells. Photoelectrochemical cells Solar energy
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!