3-D conjugate heat transfer analysis of PLCC packages mounted in-line on a Printed Circuit Board

This paper presents a three dimensional heat and fluid flow analysis of two Plastic Leaded Chip Carrier (PLCC) packages mounted in tandem arrangement on a Printed Circuit Board (PCB) exposed to the free stream velocity. The numerical simulation was done using FLUENT 6.3 and the experiments were perf...

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Veröffentlicht in:	International communications in heat and mass transfer 2009-10, Vol.36 (8), p.813-819
Hauptverfasser:	Yusoff, S., Mohamed, M., Ahmad, K.A., Abdullah, M.Z., Mujeebu, M.A., Mohd Ali, Z., Idrus, F., Yaakob, Y.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aerodynamics Applied sciences Circuit boards Computational fluid dynamics Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Fluid flow Heat transfer Integrated circuits Junction temperature Nusselt number Packages PLCC package Printed circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Thermal resistance
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