Dielectric resolution enhancement coating technology (DiRECT) - a sub-90 nm space and hole patterning technology using 248-nm lithography and plasma-enhanced polymerization

A plasma polymerization coating process named Dielectric Resolution Enhancement Coating Technology (DiRECT) is proposed to shrink critical dimensions (CDs) of space and hole patterns. Fluorocarbon plasmas are used as the precursors to coat a polymer layer on the patterned photo-resist. By adding onl...

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Veröffentlicht in:IEEE electron device letters 2003-09, Vol.24 (9), p.562-564
Hauptverfasser: Ming-Chung Liang, Hsin-Yi Tsai, Chia-Chi Chung, Cheng-Chen Hsueh, Chung, H., Chih-Yuan Lu
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Sprache:eng
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