III-V/silicon photonics for on-chip and intra-chip optical interconnects

In this paper III‐V on silicon‐on‐insulator (SOI) heterogeneous integration is reviewed for the realization of near infrared light sources on a silicon waveguide platform, suitable for inter‐chip and intra‐chip optical interconnects. Two bonding technologies are used to realize the III‐V/SOI integra...

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Veröffentlicht in:	Laser & photonics reviews 2010-11, Vol.4 (6), p.751-779
Hauptverfasser:	Roelkens, G., Liu, L., Liang, D., Jones, R., Fang, A., Koch, B., Bowers, J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding III-V photonics Infrared Lasers optical interconnect Optical interconnects Photonics Platforms Silicon Silicon photonics wafer bonding Wafers
Online-Zugang:	Volltext
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