Synthesis and characterization of novel silicon-containing aromatic bispropargyl ether resins and their composites

A series of silicon-containing aromatic bispropargyl ether resins—poly(dimethylsilylene-co-propynylene ether resorcinol) [–Si(CH 3 ) 2 –C≡C–CH 2 –O–Ar–O–CH 2 –C≡C–] n (polymer a ), poly(dimethylsilylene-co-propynylene ether bisphenol A) [–Si(CH 3 ) 2 –C≡C–CH 2 –O–Ar–C(CH 3 ) 2 –Ar–O–CH 2 –C≡C–] n (polymer b ) and poly(dimethylsilylene-co-propynylene ether hexafluorobisphenol A) [–Si(CH 3 ) 2 –C≡C–CH 2 –O–Ar–C(CF 3 ) 2 –Ar–O–CH 2 –C≡C–] n (polymer c )—were synthesized from bispropargyl ethers bisphenol and dimethyldichlorosilane by a Grignard reaction. The polymers were characterized by Fourier transform infrared, hydrogen-1 nuclear magnetic resonance, gel-permeation chromatography, rheological analysis, differential scanning calorimetry and thermogravimetric analysis. The results showed that the obtained polymers could be cured at ∼240 °C and displayed good heat resistance and processing properties. Degradation temperatures of the three cured polymers at 5% weight loss ( T d5 ) were above 400 °C, and thermal stabilities increased in the order polymer c