Predicting cohesive failure in thermosets

Modeling of stresses in epoxies used as adhesives, coatings, or encapsulants in electronic packaging can guide an engineer to more robust designs and material selections. However, stresses by themselves allow evaluation of qualitative trends only. Quantitative assessment of design margins requires s...

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Veröffentlicht in:Journal of applied polymer science 2011-02, Vol.119 (4), p.2143-2152
Hauptverfasser: Adolf, Douglas B., Chambers, Robert S., Elisberg, Brenton, Stavig, Mark, Ruff, Mary
Format: Artikel
Sprache:eng
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