Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites

A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative‐tone photosensitive polyimide (PSPI) precursor. 3‐Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes...

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Veröffentlicht in:	Journal of applied polymer science 2011-07, Vol.121 (2), p.916-922
Hauptverfasser:	Li, Tung-Lin, Hsu, Steve Lien-Chung
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Boron nitride Composites Dispersions Exact sciences and technology Forms of application and semi-finished materials Heat transfer Materials science Nanocomposites Nanomaterials Nanostructure photoresists Polyimide resins polyimides Polymer industry, paints, wood Polymers Technology of polymers Thermal conductivity
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